Method of reducing pattern distortions during imprint lithography processes
First Claim
1. A method of reducing distortions in a pattern disposed on a layer of a substrate, defining a recorded pattern, employing a mold having features to form said pattern on said layer, defining an original pattern, said method comprising:
- defining a region on said layer in which to produce said recorded pattern;
creating relative extenuative variations between said substrate and said mold by varying a temperature of one of said substrate and said mold so that an area defined by said original pattern differs from said area defined by said region; and
applying mechanical stresses to said mold to varying said area associated with said original pattern to be coextensive with said area defined by said region.
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Accused Products
Abstract
The present invention is directed to a method of reducing distortions in a pattern disposed on a layer of a substrate, defining a recorded pattern, employing a mold having the pattern recorded therein, defining an original pattern. The method includes, defining a region on the layer in which to produce the recorded pattern. Relative extenuative variations between the substrate and the mold are created to ensure that the original pattern defines an area coextensive with the region. Thereafter, the recorded pattern is formed in the region. The relative extenuative variations are created by heating or cooling of the substrate so that the region defines an area that is slightly smaller/larger than the area of the original pattern. Then compression/tensile forces are applied to the mold to provide the recorded pattern with an area coextensive with the area of the region.
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Citations
20 Claims
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1. A method of reducing distortions in a pattern disposed on a layer of a substrate, defining a recorded pattern, employing a mold having features to form said pattern on said layer, defining an original pattern, said method comprising:
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defining a region on said layer in which to produce said recorded pattern;
creating relative extenuative variations between said substrate and said mold by varying a temperature of one of said substrate and said mold so that an area defined by said original pattern differs from said area defined by said region; and
applying mechanical stresses to said mold to varying said area associated with said original pattern to be coextensive with said area defined by said region. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of reducing distortions in a pattern disposed on a layer of a substrate, defining a recorded pattern, employing a mold having features to form said pattern on said layer, defining an original pattern, said method comprising:
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defining a plurality of regions on said layer in which to produce said recorded pattern by depositing a plurality of beads of polymerizable material upon said substrate, and spreading said plurality of beads over said substrate to define said layer by repeatably superimposing a mold, having a relief structure, with each of said plurality of regions and contacting said plurality of beads with said mold to create a recess and a protrusion;
forming a plurality of fiducials in each of said plurality of regions and providing said mold with a plurality of alignment marks;
creating relative extenuative variations between said substrate and said mold by varying a temperature of one of said substrate and said mold so that an area defined by said original pattern differs from an area defined by said one of said plurality of regions in superimposition therewith;
applying mechanical stresses to said mold to vary said area defined by said original pattern to be coextensive with said area defined by said one of said plurality of regions; and
sensing differences in alignment between said fiducials and said alignment marks. - View Dependent Claims (11, 12, 13, 14)
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15. A method of reducing distortions in a pattern disposed on a layer of a substrate, defining a recorded pattern, employing a mold having features to form said pattern on said layer, defining an original pattern, said method comprising:
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defining a region on said layer in which to produce said recorded pattern;
creating relative extenuative variations, in first and second transverse directions, between said substrate and said mold by varying a temperature of one of said substrate and said mold so a distance said original pattern extends along said first direction differs from a distance that said region extends along said first direction; and
applying mechanical stress to said mold to vary said distance said original pattern extends along said first direction to be coextensive with said distance said region extends along said first direction. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification