Tamper-responding encapsulated enclosure having flexible protective mesh structure
First Claim
Patent Images
1. A method of manufacturing a tamper respondent electronic circuit article comprising:
- screen printing a pattern of flexible electrically conductive first circuit lines forming a first resistor network on a first side of a flexible dielectric; and
photolithographically forming a pattern of flexible electrically conductive second circuit lines forming a second resistor network on a second side of said flexible dielectric.
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Abstract
A structure and method for forming a tamper respondent electronic circuit enclosure that includes an integrated circuit structure, a mesh structure surrounding the integrated circuit structure, and a sealed enclosure surrounding the mesh structure. The mesh structure includes a layer of flexible dielectric having a first side and a second side, a screen-printed pattern of flexible electrically conductive first circuit lines forming a first resistor network on the first side, and a photo lithographically-formed pattern of flexible electrically conductive second circuit lines forming a second resistor network on the second side.
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Citations
6 Claims
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1. A method of manufacturing a tamper respondent electronic circuit article comprising:
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screen printing a pattern of flexible electrically conductive first circuit lines forming a first resistor network on a first side of a flexible dielectric; and
photolithographically forming a pattern of flexible electrically conductive second circuit lines forming a second resistor network on a second side of said flexible dielectric. - View Dependent Claims (2, 3, 4, 5, 6)
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Specification