Circuit arrangement
First Claim
Patent Images
1. A circuit arrangement comprising:
- a power section, which comprises heat-generating components comprising first and second chips and at least one component producing less heat, the component producing less heat being arranged in an internal region of the circuit arrangement, and the heat-generating components being arranged around the internal region and being mounted on one of at least two metallic bodies acting as electrical conductors, said bodies being electrically connected to the heat-generating components, wherein the bodies are arranged in an electrically insulating manner on a heat sink, in order to cool the heat-generating components, said bodies comprising a first metallic body and a second metallic body, said first chips being mounted on the first metallic body running along the outer edge of the heat sink, and said second chips being mounted on the second metallic body covering the internal region of the heat sink.
3 Assignments
0 Petitions
Accused Products
Abstract
The circuit has a power stage (LE) with heat generating components mounted around at least one component that generates less heat mounted in an inner region. The heat generating components are connected to at least one conducting metal body (K1) that is mounted on a cooling body (KK) in electrically insulated manner to cool the components. The cooling body encloses the inner region.
-
Citations
17 Claims
-
1. A circuit arrangement comprising:
-
a power section, which comprises heat-generating components comprising first and second chips and at least one component producing less heat, the component producing less heat being arranged in an internal region of the circuit arrangement, and the heat-generating components being arranged around the internal region and being mounted on one of at least two metallic bodies acting as electrical conductors, said bodies being electrically connected to the heat-generating components, wherein the bodies are arranged in an electrically insulating manner on a heat sink, in order to cool the heat-generating components, said bodies comprising a first metallic body and a second metallic body, said first chips being mounted on the first metallic body running along the outer edge of the heat sink, and said second chips being mounted on the second metallic body covering the internal region of the heat sink. - View Dependent Claims (2, 3, 4, 5, 6)
-
-
7. A circuit arrangement comprising:
-
a set of first chips, a set of second chips a heat sink having an inner top surface region and an outer top surface region of lesser area, a first metallic body arranged on top of the heat sink and substantially covering the inner top surface region of the heat sink, and a set of metallic bodies arranged on top of the heat sink running along the outer top surface region of the heat sink and surrounding the first metallic body, wherein the first chips are mounted on the first metallic body and the second chips are mounted on the set of metallic bodies. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14, 15)
-
-
16. A circuit arrangement comprising:
-
a power section, which comprises heat-generating components and at least one component producing less heat, the component producing less heat being arranged in an internal region of the circuit arrangement, and the heat-generating components being arranged around the internal region and being mounted on first and second metallic bodies acting as an electrical conductors, said bodies being electrically connected to the heat-generating components, the bodies are arranged in an electrically insulating manner in the region of the heat-generating components on a heat sink, in order to cool the heat-generating components, the heat sink running underneath the internal region of the circuit arrangement with the components producing less heat, a third metallic body comprising a board covering the internal region and arranged above the component producing less heat, the board comprising at least one opening above the internal region, the component producing less heat being embodied as a capacitor and being electrically connected to the third metallic board via a first wired bond, which is led through the opening, the heat-generating components being embodied as bare first and second chips, each containing a transistor and being mounted on the two metallic bodies, the first chips mounted on the first metallic body comprising a board, the second chips mounted on the second metallic body comprising a bar, the first metallic body running along the outer edge of the heat sink, the second metallic body covering the internal region and inner edge of the heat sink, the first chips electrically connected to the first metallic body via bonding connections, and the second chips electrically connected to the second metallic body via bonding connections.
-
-
17. A circuit arrangement comprising:
-
a power section, which comprises heat-generating components and at least one component producing less heat, the component producing less heat being arranged in an internal region of the circuit arrangement, and the heat-generating components being arranged around the internal region and being mounted on at least one metallic body acting as an electrical conductor, said body being electrically connected to the heat-generating components, wherein the body is arranged in an electrically insulating manner in the region of the heat-generating components on a heat sink, in order to cool the heat-generating components, the heat sink running underneath the internal region of the circuit arrangement with the components producing less heat, a logic section, arranged above the internal region, said logic section electrically connected to the power section via bonding connections.
-
Specification