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Circuit arrangement

  • US 6,930,373 B2
  • Filed: 08/27/2003
  • Issued: 08/16/2005
  • Est. Priority Date: 02/27/2001
  • Status: Expired due to Fees
First Claim
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1. A circuit arrangement comprising:

  • a power section, which comprises heat-generating components comprising first and second chips and at least one component producing less heat, the component producing less heat being arranged in an internal region of the circuit arrangement, and the heat-generating components being arranged around the internal region and being mounted on one of at least two metallic bodies acting as electrical conductors, said bodies being electrically connected to the heat-generating components, wherein the bodies are arranged in an electrically insulating manner on a heat sink, in order to cool the heat-generating components, said bodies comprising a first metallic body and a second metallic body, said first chips being mounted on the first metallic body running along the outer edge of the heat sink, and said second chips being mounted on the second metallic body covering the internal region of the heat sink.

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