Method to perform thermal simulation of an electronic circuit on a network

• US 6,931,369 B1
• Filed: 05/01/2001
• Issued: 08/16/2005
• Est. Priority Date: 05/01/2001
• Status: Active Grant

• Current Assignee: National Semiconductor Corporation (Texas Instruments, Inc.)
• Original Assignee: National Semiconductor Corporation (Texas Instruments, Inc.)
• Inventors: Perzow, John D., Sojrani, Vandana A., Gibson, Phil, Perry, Jeffrey Robert, Allison, Rex L. III, Nguyen, Khang, Levin, Richard, Garrison, Martin, Garrett, Wanda Carol
• Primary Examiner(s): PHAN, THAI Q
• Application Number:
  US09/846,681
• Time in Patent Office: 1,568 Days
• Field of Search: 703/14, 703/18, 703/13, 703/6, 716/4, 716/5, 716/8, 257/301, 257/313
• US Class Current: 703/18
• CPC Class Codes: G06F 2111/02 CAD in a network environment, e.g. collaborative CAD or distributed simulation
• CPC Class Codes: G06F 2111/10 Numerical modelling
• CPC Class Codes: G06F 30/367 Design verification, e.g. using simulation, simulation program with integrated circuit emphasis [SPICE], direct methods or relaxation methods

Abstract

A method and apparatus for thermally simulating a circuit over a network is provided. Techniques are provided for designing a circuit that satisfies user-specified functional requirements received over a network. Based on the specified requirements, components and a topology for constructing the circuit are automatically determined. The components determined during this operation have operational values such that, when the components are arranged according to the topology to form the circuit, the circuit satisfies the user-specified functional requirements. One or more web pages that identify the components are then delivered to the browser over the network. The component and topology information may be used to generate a schematic diagram that is delivered in a web page to the user over the network. The user may thermally simulate the designed circuit. Many characteristics of the board may be adjusted to provide an accurate thermal simulation. The user may place an order over the network for one of the components, a kit of all of the components, a custom made circuit made from the components, and/or a prefabricated circuit that is functionally similar to the one that was designed.

Claims

1. A method for thermally simulating a circuit over a network, the circuit having components laid out on a board, comprising:

determining the circuit to be thermally simulated over the network;

determining a set of thermal characteristics for the circuit;

performing a thermal simulation of the circuit based on the determined set of thermal characteristics, wherein the thermal simulation is performed on a computer that is different from a computer the user is using to access the network;

producing a result based on the thermal simulation of the circuit; and

providing the result over the network to the user.

2. The method of claim 1, further comprising:

allowing the user to change a characteristic of the circuit;

determining when the user has changed the characteristic of the circuit; and

performing a thermal simulation of the circuit when a determination has been made that the user has changed the characteristic of the circuit.

3. The method of claim 1, further comprising allowing the user to order the circuit over the network.

4. The method of claim 2, wherein producing the result based on the thermal simulation, further comprises, producing a design document for the circuit.

5. The method of claim 2, wherein providing the result over the network to a user further comprises allowing the user to share the circuit.

6. The method of claim 2, wherein producing the result based on the thermal simulation, further comprises producing operating temperatures of the components.

7. The method of claim 2, wherein producing the result based on the thermal simulation, further comprises producing a graphical plot of temperature intensities across the board.

8. The method of claim 2, wherein producing the results based on the thermal simulation, further comprise:

creating a graphical layout showing the location of components on the board; and

displaying the graphical layout to the user.

9. The method of claim 2, wherein allowing the user to change the characteristic of the circuit, further comprises allowing the user to specify at least one thermal characteristic of the circuit.

10. The method of claim 9, further comprising allowing the user to add at least one heat sink to the circuit.

11. The method of claim 9, wherein allowing the user to specify the at least one thermal characteristic of the circuit, further comprises allowing the user to add at least one fan to the circuit.

12. The method of claim 11, wherein allowing the user to add the at least one fan to the circuit to provide airflow further comprises allowing the user to change a direction and airflow of the at least one fan.

13. A modulated data signal embodied in a carrier wave and representing computer executable instructions for thermally simulating a circuit over a network, comprising:

determining the circuit to simulate over the network;

determining a set of characteristics for the circuit;

performing a thermal simulation of the circuit based on the determined set of characteristics, wherein the thermal simulation is performed on a computer that is different from a computer the user is using to access the network;

producing a thermal result based on the thermal simulation of the circuit; and

providing a result based on the thermal result over the network to the user.

14. The modulated data signal of claim 13, further comprising:

allowing the user to change a characteristic from the set of characteristics for the circuit; and

performing the thermal simulation when the user changes the characteristic.

15. The modulated data signal of claim 13, further comprising allowing the user to order the circuit over the network.

16. The modulated data signal of claim 13, wherein providing the result, further comprises providing a design document for the circuit.

17. The modulated data signal of claim 15, wherein providing the result, further comprises allowing the user to share the circuit.

18. The modulated data signal of claim 13, wherein providing the result, further comprises:

creating a graphical layout showing the location of components on the board; and

displaying the graphical layout to the user.

19. A system for thermally simulating a circuit over a network, comprising:

a client having a client network connection device operative to connect the client to the network;

a server having a server network connection device operative to connect the server to the network; and

operative to perform actions, including;

communicating with the client;

determining the circuit to simulate;

determining a thermal characteristic for the circuit;

performing a thermal simulation of the circuit based on the determined thermal characteristic;

providing a result to the client over the network based on the thermal simulation.

20. The system of claim 19, further comprising:

allowing the client to change the thermal characteristic; and

performing the thermal simulation the thermal characteristic is changed.

21. The system of claim 19, further comprising allowing the circuit to be ordered over the network.

22. The system of claim 19, wherein providing the result to the client over the network based on the thermal simulation further comprises delivering a design document to the client.

23. The system of claim 19, wherein providing the result to the client over the network based on the thermal simulation further comprises allowing the circuit to be shared.

24. An apparatus for thermally simulating a circuit over a network, comprising:

a means for determining the circuit to be thermally simulated over the network;

a means for determining a set of thermal characteristics for the circuit;

a means for performing a thermal simulation of the circuit based on the determined set of thermal characteristics, wherein the thermal simulation is performed on a computer that is different from a computer the user is using to access the network;

a means for producing a result based on the thermal simulation of the circuit; and

a means for providing the result over the network to the user.

25. The apparatus of claim 24, further comprising a means for ordering the circuit over the network.