Sensor top hat cover apparatus and method

• US 6,931,934 B2
• Filed: 09/10/2003
• Issued: 08/23/2005
• Est. Priority Date: 09/10/2003
• Status: Expired due to Fees

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Marsh, Brian J., Dale, Richard L., Cook, James D., Gall, Kenneth E.
• Primary Examiner(s): Oen, William
• Assistant Examiner(s): ALLEN, ANDRE J
• Application Number:
  US10/660,175
• Publication Number:
  US 20050050955A1
• Time in Patent Office: 713 Days
• Field of Search: 737/00, 737/15, 737/21, 737/27, 737/291
• US Class Current: 73/715
• CPC Class Codes: G01L 9/0025 with acoustic surface waves
• CPC Class Codes: G01L 9/0064 the element and the diaphragm being in intimate contact

Abstract

A sensor apparatus and method are disclosed herein, including a sensor element located on a base and a cover located proximate to the base. The cover generally includes a sensor diaphragm and a dimple that can form a part of the cover. A flanged area or flanged portion can also be connected to the bottom portion of the cover. The flanged area provides a surface for contacting a fixture to which the sensor apparatus attaches and holding the sensor apparatus to the fixture in a manner which prevents the sensor diaphragm from contacting the fixture and inducing errors during sensor operations thereof. The cover also can include a flanged or brim-shaped portion which is connected to and surrounds the bottom portion of the cover. The flanged portion can be positioned parallel to the sensor diaphragm.

Claims

1. A sensor apparatus, comprising:

a sensor element located on a base;

a cover located proximate to said base, wherein said cover comprises a sensor diaphragm and an inward dimple that is formed into and a part of said cover and wherein said inward dimple is formed from and incorporated into said cover; and

a flanged area formed to a bottom portion of said cover, wherein said flanged area is connected to and surrounds said bottom portion of said cover and is further positioned parallel to said sensor diaphragm, such that said flanged area provides a surface for contacting a fixture to which said sensor apparatus attaches and holding said sensor apparatus to said fixture in a manner which prevents said sensor diaphragm from contacting said fixture and inducing errors during sensor operations thereof.

2. The apparatus of claim 1 wherein said cover comprises a pressure transducer sensor diaphragm.

3. The apparatus of claim 1 wherein said sensor element comprises quartz.

4. The apparatus of claim 1 wherein said sensor element comprises ceramic.

5. The apparatus of claim 1 wherein said sensor element comprises silicon.

6. The apparatus of claim 1 wherein said sensor apparatus comprises a pressure sensor.

7. The apparatus of claim 1 wherein said sensor apparatus comprises a surface acoustic wave (SAW) pressure sensor.

8. A pressure sensor apparatus, comprising:

a sensor element located on a base, wherein said sensor element comprises at least one of the following materials;

ceramic, silicon and quartz;

a cover located proximate to said base, wherein said cover comprises a pressure transducer sensor diaphragm and an inward dimple that is formed into and a part of said cover, wherein said dimple is formed from and incorporated into said cover; and

a flanged area formed to a bottom portion of said cover, wherein said flanged area is connected to and surrounds said bottom portion of said cover and is positioned parallel to said sensor diaphragm, and such that said flanged area provides a surface for contacting a fixture to which said sensor apparatus attaches and holding said sensor apparatus to said fixture in a manner which prevents said sensor diaphragm from contacting said fixture and inducing errors during sensor operations thereof, wherein said sensor apparatus comprises a surface acoustic wave (SAW) pressure sensor.

9. A sensor method, comprising the steps of:

locating a sensor element on a base;

positioning a cover proximate to said base, wherein said cover comprises a sensor diaphragm and an inward dimple that is formed into and a part of said cover, wherein said inward dimple is formed from and incorporated into said cover;

forming a flanged area at a bottom portion of said cover; and

connecting said flanged area to said bottom portion of said cover, wherein said flanged area provides a surface for contacting a fixture to which said sensor apparatus attaches and holding said sensor apparatus to said fixture in a manner which prevents said sensor diaphragm from contacting said fixture and inducing errors during sensor operations thereof.

10. The method of claim 9 further comprising the steps of:

surrounding said bottom portion of said cover with said flanged area; and

positioning said flanged area parallel to said sensor diaphragm.

11. The method of claim 9 further comprising the step of:

configuring said cover to comprise a pressure transducer sensor diaphragm.

12. The method of claim 9 wherein said sensor element comprises quartz.

13. The method of claim 9 wherein said sensor element comprises ceramic.

14. The method of claim 9 wherein said sensor element comprises silicon.

15. The method of claim 9 wherein said sensor apparatus comprises a pressure sensor.

16. The method of claim 9 wherein said sensor apparatus comprises a surface acoustic wave (SAW) pressure sensor.