Apparatus and method for loading a wafer in polishing system
First Claim
1. A method of processing a semiconductor wafer comprising:
- positioning the wafer below a wafer housing;
supporting the wafer around, its periphery; and
loading the wafer into a wafer housing cavity.
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Accused Products
Abstract
The present invention includes a polishing pad or belt secured to a mechanism that allows the pad or belt to move in a reciprocating manner, i.e. in both forward and reverse directions, at high speeds. The constant bidirectional movement of the polishing pad or belt as it polishes the wafer provides superior planarity and uniformity across the wafer surface. When a fresh portion of the pad is required, the pad is moved through a drive system containing rollers, such that the rollers only touch a back side of the pad, thereby minimizing sources of friction other than the wafer that is being polished from the polishing side of the pad, and maximizing the lifetime of the polishing pad.
76 Citations
24 Claims
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1. A method of processing a semiconductor wafer comprising:
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positioning the wafer below a wafer housing;
supporting the wafer around, its periphery; and
loading the wafer into a wafer housing cavity. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method of processing a semiconductor wafer comprising:
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positioning the wafer in a cavity of a wafer housing;
positioning a retractable support structure below the surface of the wafer;
extending the support structure to support the wafer;
moving the support structure so that the wafer is positioned near the surface of the wafer housing; and
clearing the support structure from the surface of the wafer. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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16. A semiconductor wafer processing device comprising:
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a wafer housing; and
a support structure attached to the wafer housing configured to load a wafer into a wafer housing cavity. - View Dependent Claims (17, 18, 19, 20, 21)
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- 22. A semiconductor wafer processing device comprising a head assembly having a cavity adapted to support a wafer and a movable pin housing that includes pins adapted to protrude in and out of the pin housing.
Specification