Measurement configuration including a vehicle and method for performing measurements with the measurement configuration at various locations

• US 6,935,201 B2
• Filed: 08/11/2003
• Issued: 08/30/2005
• Est. Priority Date: 02/10/2001
• Status: Expired due to Term

• Current Assignee: Qimonda AG (Infineon Technologies AG), Rudolph Technologies Germany GmbH (Onto Innovation Inc.)
• Original Assignee: Infineon Technologies AG, NanoPhotonics AG (Onto Innovation Inc.)
• Inventors: Abraham, Michael, Marx, Eckhard
• Primary Examiner(s): Williams, Hezron
• Assistant Examiner(s): Fitzgerald, John
• Application Number:
  US10/638,599
• Publication Number:
  US 20040050189A1
• Time in Patent Office: 750 Days
• Field of Search: 738/658, 198/339.1, 312/1, 414/935
• US Class Current: 73/865.8
• CPC Class Codes: H01L 21/67253 Process monitoring, e.g. flow or thickness monitoring
• CPC Class Codes: H01L 21/67772 involving removal of lid, door, cover

Abstract

A measurement device, i.e. a metrology tool, and a vehicle are combined to provide a mobile metrology in a fabrication facility. Peripheral equipment such as a device transfer unit, for, e.g., FOUPs in semiconductor manufacturing, an electronic control system with, e.g., a PC, monitor, and keyboard and optionally a vacuum pump is also provided in module frames of the vehicle. The measurement configuration particularly reduces bottleneck situations in equipment qualifying of processing tools during fast ramp-up phases of, e.g., semiconductor manufacturing facilities, thereby saving costs. The construction is based on PGVs or AGVs and allows a fast operation directly at the location of a processing tool. With the possible exception of power supply or operator control, the measurement configuration can operate fully autonomously.

Claims

1. A measurement configuration for measuring a feature of a plate-like object, comprising:

a measurement device for measuring the feature;

an electronic control system for controlling said measurement device;

a transfer unit for providing the plate-like object to said measurement device;

a device for providing electrical power to the measurement configuration; and

a vehicle for providing mobility to the measurement configuration, said vehicle including module frames each respectively receiving one of said measurement device, said electronic control system, said transfer unit, and said device for providing electrical power;

the measurement configuration having a total weight from 20 kg to 150 kg.

2. The configuration according to claim 1, wherein the feature is at least one of a length, a width, a depth, a position of a structure, a thickness of a film, and a defect on the plate-like object.

3. The configuration according to claim 1, wherein said measurement device is selected from the group consisting of a defect inspection tool, an ellipsometer, a particle counter, a reflectometer, a Fourier transform spectrometer, a CD measurement tool, an overlay measurement tool, and a scanning electron microscope.

4. The configuration according to claim 1, wherein the plate-like object is a mask.

5. The configuration according to claim 1, wherein said vehicle provides self-powered movement of the measurement configuration and includes a drive, a brake, and a steerable wheel.

6. The configuration according to claim 1, further comprising a printer connected to said electronic control system, said vehicle being provided with a space for receiving said printer.

7. The configuration according to claim 1, further comprising a vibration damping device for preventing said measurement device from receiving vibration being transmitted by said vehicle.

8. The configuration according to claim 1, further comprising a device for docking said vehicle at a location in a fabrication system.

9. The configuration according to claim 1, wherein said vehicle includes a wheel for rolling said vehicle between two locations.

10. The configuration according to claim 1, wherein the plate-like object is a semiconductor wafer.

11. The configuration according to claim 10, wherein the measurement configuration has a width from 300 millimeters to 1000 millimeters.

12. The configuration according to claim 10, wherein:

said measurement device has a chuck for holding the semiconductor wafer;

a vacuum pump is connected to said chuck; and

said vehicle has a space for receiving said vacuum pump.

13. The configuration according to claim 10, wherein said device for providing electrical power to the measurement configuration includes an accumulator.

14. A method for performing a measurement of a feature of a plate-like object, which comprises the steps:

providing a measurement configuration according to claim 10;

moving the measurement configuration from a first location to a second location before a loadport of a process tool;

loading the plate-like object from the loadport of the process tool to the measuring device using a wafer carrier;

measuring the plate-like object without a physical connection except for at least one of an electrical power supply, a wireless data transfer, and a docking connection;

unloading the plate-like object from the measuring device using the wafer carrier; and

moving the measurement configuration to a third location.

15. The configuration according to claim 1, further comprising a data transfer unit for transferring data between said electronic control system and a factory-wide communication system, said vehicle being provided with a space for receiving said data transfer unit.

16. The configuration according to claim 15, wherein said data transfer unit has a device to transfer the data via a wireless communication channel.

17. The configuration according to claim 10, further comprising a device for providing a mini-environment including a filter system for reducing a density of contaminating particles surrounding the semiconductor wafer during a wafer measurement, said vehicle having a space for receiving said device for providing a mini-environment.

18. The configuration according to claim 17, wherein said device for providing a mini-environment includes:

a sliding area for providing a laminar air flow inside said measurement device;

a sensor for detecting an electrical power connection; and

a device for hermetically enclosing at least a sensor area inside said measurement device and being connected to said sensor for detecting an electrical power connection.

19. The configuration according to claim 17, wherein said device for providing a mini-environment includes an interface for docking and undocking a wafer carrier to said measurement device to preserve a low density of the contaminating particles surrounding the semiconductor wafer during a wafer transfer.

20. The configuration according to claim 19, wherein said interface for docking and undocking includes an electrical driving device.

21. The configuration according to claim 19, wherein:

said wafer carrier has a wafer carrier door; and

said device for providing a mini-environment includes an interface for opening and closing said wafer carrier door.

22. The configuration according to claim 21, wherein said interface for opening and closing a wafer carrier door includes an electrical driving device.