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Bendable high flux LED array

  • US 6,936,855 B1
  • Filed: 01/07/2003
  • Issued: 08/30/2005
  • Est. Priority Date: 01/16/2002
  • Status: Active Grant
First Claim
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1. A bendable electromagnetic radiation emitting semiconductor dice array comprising:

  • a plurality of metal heat spreaders;

    at least one dielectric layer disposed above a first portion of each of the underlying plurality of metal heat spreaders, creating a first portion of a plurality of openings, each opening disposed over a corresponding metal heat spreader;

    a bendable electrical interconnection layer disposed above a first portion of the at least one dielectric layer and creating a second portion of each said opening disposed over a corresponding metal heat spreader, wherein said bendable electrical interconnection layer comprises a plurality of electrical current pathways; and

    a plurality of electromagnetic radiation emitting semiconductor dice, wherein each of the dice is mounted over a corresponding one of the plurality of metal heat spreaders with a corresponding thermal conduction means that provides a direct thermal pathway from the die to the underlying metal heat spreader, and wherein each die is electrically coupled to the bendable electrical interconnection layer.

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