Bendable high flux LED array
First Claim
1. A bendable electromagnetic radiation emitting semiconductor dice array comprising:
- a plurality of metal heat spreaders;
at least one dielectric layer disposed above a first portion of each of the underlying plurality of metal heat spreaders, creating a first portion of a plurality of openings, each opening disposed over a corresponding metal heat spreader;
a bendable electrical interconnection layer disposed above a first portion of the at least one dielectric layer and creating a second portion of each said opening disposed over a corresponding metal heat spreader, wherein said bendable electrical interconnection layer comprises a plurality of electrical current pathways; and
a plurality of electromagnetic radiation emitting semiconductor dice, wherein each of the dice is mounted over a corresponding one of the plurality of metal heat spreaders with a corresponding thermal conduction means that provides a direct thermal pathway from the die to the underlying metal heat spreader, and wherein each die is electrically coupled to the bendable electrical interconnection layer.
1 Assignment
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Accused Products
Abstract
A bendable light emitting diode (LED) array in accordance with the present invention includes heat spreaders, dielectric material disposed above each heat spreader, and a bendable electrical interconnection layer disposed above these heat spreaders and electrically insulated from these heat spreaders by the dielectric material. At least one via passes through the dielectric material above each heat spreader, and at least one LED die is disposed above each via. The bendable electrical interconnection layer may be a lead frame comprising metal pathways that electrically interconnect some or all LED dice in series, in parallel, in anti-parallel, or in some combination of these configurations. Each via contains a thermally conductive material in thermal contact with the corresponding heat spreader below it and in thermal contact with the corresponding LED die above it. The LED dice may be thermally and electrically coupled to submounts disposed above corresponding heat spreaders in some embodiments.
617 Citations
49 Claims
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1. A bendable electromagnetic radiation emitting semiconductor dice array comprising:
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a plurality of metal heat spreaders; at least one dielectric layer disposed above a first portion of each of the underlying plurality of metal heat spreaders, creating a first portion of a plurality of openings, each opening disposed over a corresponding metal heat spreader; a bendable electrical interconnection layer disposed above a first portion of the at least one dielectric layer and creating a second portion of each said opening disposed over a corresponding metal heat spreader, wherein said bendable electrical interconnection layer comprises a plurality of electrical current pathways; and a plurality of electromagnetic radiation emitting semiconductor dice, wherein each of the dice is mounted over a corresponding one of the plurality of metal heat spreaders with a corresponding thermal conduction means that provides a direct thermal pathway from the die to the underlying metal heat spreader, and wherein each die is electrically coupled to the bendable electrical interconnection layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 26, 27, 29, 30, 31, 32, 49)
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20. A bendable electromagnetic radiation emitting semiconductor dice array comprising:
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a bendable metal frame comprising a plurality of metal heat spreaders and a plurality of bendable electrical current pathways; at least one dielectric material disposed between each heat spreader of said plurality of metal heat spreaders and at least one pathway of said plurality of bendable electrical current pathways; and a plurality of electromagnetic radiation emitting semiconductor dice, wherein each of the dice is mounted above a portion of the corresponding heat spreader'"'"'s top surface with a corresponding thermal conduction means that provides a direct thermal path from the die to the corresponding heat spreader, and wherein each of the dice is electrically coupled to at least two pathways of said plurality of bendable electrical current pathways; and
wherein a heat transfer surface of each heat spreader of said plurality of metal heat spreaders has a greater surface area than the bottom surface of each die of said plurality of electromagnetic radiation emitting semiconductor dice. - View Dependent Claims (21, 22, 23, 24, 25, 28, 33, 34)
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35. A method of assembling a bendable electromagnetic radiation emitting semiconductor dice array comprising:
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providing a bendable electrical interconnection layer; attaching a plurality of heat spreaders to the bendable electrical interconnection layer via at least one adhesive dielectric layer, wherein a portion of a first surface of each heat spreader is exposed; attaching a plurality of electromagnetic radiation emitting semiconductor dice to said plurality of heat spreaders by mounting each die of said plurality of electromagnetic radiation emitting semiconductor dice to the exposed portion of the first surface of a corresponding heat spreader via a corresponding thermal conductor; and electrically coupling each die of said plurality of electromagnetic radiation emitting semiconductor dice into a functional electrical circuit configuration via said bendable electrical interconnection layer. - View Dependent Claims (36, 37, 38, 39, 40, 41)
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42. A method of providing a bendable electromagnetic radiation emitting semiconductor dice array comprising:
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providing a bendable lead frame structure, wherein said bendable lead frame structure comprises a plurality of predefined metal heat spreader regions and a plurality of predefined bendable metal electrical current pathways; attaching a plurality of electromagnetic radiation emitting semiconductor dice to said plurality of predefined metal heat spreader regions by mounting each of the dice to a corresponding one of the predefined metal heat spreader regions via a corresponding thermal conductor; and electrically coupling each die of said plurality of electromagnetic radiation emitting semiconductor dice into a functional electrical circuit configuration via at least two pathways of said plurality of predefined bendable metal electrical current pathways. - View Dependent Claims (43, 44, 45, 46)
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47. A bendable electromagnetic radiation emitting semiconductor dice array comprising:
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a bendable thermally conductive metal substrate; at least one dielectric layer disposed above a first portion of said bendable thermally conductive metal substrate, creating a first portion of a plurality of openings, each opening disposed over said bendable thermally conductive metal substrate; a bendable electrical interconnection layer disposed above a first portion of said at least one dielectric layer and creating a second portion of each said opening disposed over said bendable thermally conductive metal substrate, wherein said bendable electrical interconnection layer comprises a plurality of mechanical stress relief features, and wherein said bendable electrical interconnection layer comprises a plurality of electrical current pathways; and a plurality of electromagnetic radiation emitting semiconductor dice, wherein each of the dice is mounted above said bendable thermally conductive metal substrate with a corresponding thermal conduction means that provides a direct thermal pathway from the die to said bendable thermally conductive metal substrate, and wherein each one of the dice comprises a first electrical contact and a second electrical contact, said first electrical contact and said second electrical contact electrically coupled to separate pathways of said plurality of electrical current pathways. - View Dependent Claims (48)
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Specification