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Light emitting diode package

  • US 6,936,862 B1
  • Filed: 08/13/2004
  • Issued: 08/30/2005
  • Est. Priority Date: 05/20/2004
  • Status: Active Grant
First Claim
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1. A lead type light emitting diode package comprising:

  • a light emitting diode device disposed in the lead type light emitting diode package; and

    an encapsulating material covering the light emitting diode device, wherein a plurality of scatter supported wavelength converter particles are distributed in the encapsulating material an each scatterer supported wavelength converter particle comprises one phase of scatterer and at least one phase of wavelength converting activator;

    wherein portions of light beams emitted from the light emitting diode device incident to each of the scatterer supported wavelength converter particles are scattered by each of the scatterer supported wavelength converter particles, and portions of light beams emitted from the light emitting diode device incident to each of the scatterer supported wavelength converter particles are absorbed to excite each of the scatterer supported wavelength converter particles to emit light in another wavelength, the lead type light emitting diode package thereby outputting light with improved brightness.

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