Light emitting diode package

• US 6,936,862 B1
• Filed: 08/13/2004
• Issued: 08/30/2005
• Est. Priority Date: 05/20/2004
• Status: Active Grant

• Current Assignee: Lextar Electronics Corporation (Ennostar, Inc.)
• Original Assignee: Lighthouse Technologies (Ennostar, Inc.)
• Inventors: Chang, Chih-Chin, Hsieh, Hsiang-Cheng, Huang, Teng-Huei
• Primary Examiner(s): Weiss, Howard
• Assistant Examiner(s): Trinh, (Vikki) Hoa B.
• Application Number:
  US10/710,928
• Time in Patent Office: 382 Days
• Field of Search: 257/79, 257/98, 257/100, 257/103, 257/99, 257/678, 257/710, 257/704
• US Class Current: 257/100
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12032 Schottky diode
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2933/0091 Scattering means in or on the semiconductor body or semiconductor body package H01L33/22 takes precedence
• CPC Class Codes: H01L 33/501 characterised by the materials, e.g. binder
• CPC Class Codes: H01L 33/502 Wavelength conversion materials

Abstract

A light emitting diode package includes a light emitting diode device disposed in the light emitting diode package, and a molding material covering the light emitting diode device. The molding material includes a plurality of scatter supported wavelength converters. Portions of light beams emitted from the light emitting diode device incident to each of the scatter supported wavelength converters are scattered by each of the scatter supported wavelength converters and absorbed to excite each of the scatter supported wavelength converters to emit light in another wavelength.

Claims

1. A lead type light emitting diode package comprising:

a light emitting diode device disposed in the lead type light emitting diode package; and

an encapsulating material covering the light emitting diode device, wherein a plurality of scatter supported wavelength converter particles are distributed in the encapsulating material an each scatterer supported wavelength converter particle comprises one phase of scatterer and at least one phase of wavelength converting activator;

wherein portions of light beams emitted from the light emitting diode device incident to each of the scatterer supported wavelength converter particles are scattered by each of the scatterer supported wavelength converter particles, and portions of light beams emitted from the light emitting diode device incident to each of the scatterer supported wavelength converter particles are absorbed to excite each of the scatterer supported wavelength converter particles to emit light in another wavelength, the lead type light emitting diode package thereby outputting light with improved brightness.

2. The lead type light emitting diode package of claim 1 wherein the encapsulating material comprises an organic molding compound, a ceramic material permeable to light, a glass material permeable to light, an insulation fluid material permeable to light, or a composite material comprising at least two materials selected from a group consisting of the above-mentioned materials.

3. The lead type light emitting diode package of claim 1 wherein the scatterer and the wavelength converting activator have a physical or chemical bonding to each other.

4. The lead type light emitting diode package of claim 1 wherein the wavelength converting activator is a material represented by a general formula (A)_3+t+u(B)_5+u+2v(C)_12+2t+3u+3v:

D, where 0<

t<

5, 0<

u<

15, 0<

v<

9, A is at least one selected from Y, Ce, Tb, Gd, and Sc, B is at least one selected from Al, Ga, Tl, In, and B, C is at least one selected from O, S, and Se, D is at least one selected from Ce and Tb, and the scatterer comprises an oxide, a sulphuret, or a selenium compound of at least one metal element selected from the above general formula.

5. The lead type light emitting diode package of claim 1 wherein the wavelength converting activator adheres to portions of a surface of the scatterer.

6. The lead type light emitting diode package of claim 1 wherein the scatterer is encapsulated by the wavelength converting activator.

7. The lead type light emitting diode package of claim 1 wherein the wavelength converting activator is spread in the scatterer.

8. The lead type light emitting diode package of claim 1 wherein the light emitting diode device is adhered to a high reflectivity surface in the lead type light emitting diode package by a non-conductive adhesive permeable to light.

9. The lead type light emitting diode package of claim 1 further comprising a first lead used as a positive electrode and a second lead used as a negative electrode.

10. The lead type light emitting diode package of claim 9 wherein one of the first lead and the second lead comprises a cup.

11. A chip type light emitting diode package comprising:

a casing comprising a recess;

a light emitting diode device disposed in the recess; and

an encapsulating material covering the light emitting diode device, wherein a plurality of scatterer supported wavelength converter particles are distributed in the encapsulating material and each scatterer supported wavelength converter particle comprises one phase of scatterer and at least one phase of wavelength converting activator;

wherein portions of light beams emitted from the light emitting diode device incident to each of the scatterer supported wavelength converter particles are scattered by each of the scatterer supported wavelength converter particles, and portions of light beams emitted from the light emitting diode device incident to each of the scatterer supported wavelength converter particles are absorbed to excite each of the scatterer supported wavelength converter particles to emit light in another wavelength, the chip type light emitting diode package thereby outputting light with improved brightness.

12. The chip type light emitting diode package of claim 11 wherein the encapsulating material comprises an organic molding compound, a ceramic material permeable to light, a glass material permeable to light, an insulation fluid material permeable to light, or a composite material comprising at least two materials selected from a group consisting of the above-mentioned materials.

13. The chip type light emitting diode package of claim 11 wherein the scatterer and the wavelength converting activator have a physical or chemical bonding to each other.

14. The chip type light emitting diode package of claim 11 wherein the wavelength converting activator is a material represented by a general formula (A)_3+t+u(B)_5+u+2v(C)_12+2t+3u+3v:

D, where 0<

t<

5, 0<

u<

15, 0<

v<

9, A is at least one selected from Y, Ce, Tb, Gd, and Sc, B is at least one selected from Al, Ga Tl, In, and B, C is at least one selected from O, S, and Se, D is at least one selected from Ce and Tb, and the scatterer comprises an oxide, a sulphuret, or a selenium compound of at least one metal element selected from the above general formula.

15. The chip type light emitting diode package of claim 11 wherein the wavelength converting activator adheres to portions of a surface of the scatterer.

16. The chip type light emitting diode package of claim 11 wherein the scatterer is encapsulated by the wavelength converting activator.

17. The chip type light emitting diode package of claim 11 wherein the wavelength converting activator is spread in the scatterer.

18. The chip type light emitting diode package of claim 11 wherein the light emitting diode device is adhered to a high reflectivity surface in the chip type light emitting diode package by a nonconductive adhesive permeable to light.

19. The chip type light emitting diode package of claim 11 further comprising a positive electrode and a negative electrode in the case.