MEMS device with conductive path through substrate
First Claim
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1. A MEMS device comprising:
- a substrate having a top facing side and a bottom facing side, the top facing side including MEMS structure; and
at least one conductive path extending through the substrate from the MEMS structure to the bottom facing side, the at least one conductive path being integral with and formed from substantially the same material as the MEMS structure.
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Abstract
A MEMS device has at least one conductive path extending from the top facing side of its substrate (having MEMS structure) to the bottom side of the noted substrate. The at least one conductive path extends through the substrate as noted to electrically connect the bottom facing side with the MEMS structure.
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Citations
23 Claims
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1. A MEMS device comprising:
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a substrate having a top facing side and a bottom facing side, the top facing side including MEMS structure; and at least one conductive path extending through the substrate from the MEMS structure to the bottom facing side, the at least one conductive path being integral with and formed from substantially the same material as the MEMS structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A MEMS device comprising:
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a substrate having a top facing side and a bottom facing side, the top facing side including MEMS structure; and means for conducting electrical signals between the MEMS structure and the bottom facing side, the conducting means extending through the substrate from the MEMS structure to the bottom facing side, the conducting means being integral with the MEMS structure. - View Dependent Claims (11, 12, 13, 14, 15)
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16. A MEMS system comprising:
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a first substrate having circuitry and an interface port to the circuitry; a MEMS device having a second substrate with a top facing side and a bottom facing side, the top facing side including MEMS structure, the MEMS device also having a conductive path extending through the second substrate from the MEMS structure to the bottom facing side, the conductive path being integral with the MEMS structure; the conductive path being coupled with the interface port on the first substrate to electrically communicate the circuitry with the MEMS structure. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23)
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Specification