Process for encapsulating a component made of organic semiconductors
First Claim
1. A process for encapsulating a component made of organic semiconductors, said process comprising:
- providing;
(i) a substrate as a housing part with electrical connections applied to it, (ii) at least one further housing part including at least a cover, and (iii) soldering glass, wherein a coefficient of thermal expansion of the substrate, a coefficient of thermal expansion of the further housing part and a coefficient of thermal expansion of the soldering glass are matched such that the respective coefficients of thermal expansion differ from one another by less than 1.0×
10−
6K−
1;
applying the soldering glass at least to the cover, as an encircling bank, wherein the soldering glass is a pulverulent soldering glass which is tricked into position;
sintering-on the solder;
covering the substrate with the semiconductor component together with electrodes;
placing the cover onto the substrate; and
locally heating the soldering glass with a light source having a predetermined peak wavelength.
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Accused Products
Abstract
A process for encapsulating a component made of organic semiconductors is provided which includes steps of: a) providing a housing including a substrate with electrical connections and a cover; b) mixing a soldering glass with at least one of a binder and a solvent; c) applying the soldering glass at least to the cover, in the form of an encircling bank; d) expelling the binder or solvent; e) sintering-on of the solder; f) covering the substrate with layers which represent the semiconductor component together with electrodes; g) placing the cover onto the substrate; and h) locally heating the soldering glass by means of a light source with a predetermined peak wavelength, wherein the housing parts and soldering glass are matched to one another such that their coefficients of thermal expansion differ from one another by less than 1.0×10−6K−1.
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Citations
15 Claims
-
1. A process for encapsulating a component made of organic semiconductors, said process comprising:
-
providing;
(i) a substrate as a housing part with electrical connections applied to it, (ii) at least one further housing part including at least a cover, and (iii) soldering glass, wherein a coefficient of thermal expansion of the substrate, a coefficient of thermal expansion of the further housing part and a coefficient of thermal expansion of the soldering glass are matched such that the respective coefficients of thermal expansion differ from one another by less than 1.0×
10−
6K−
1;
applying the soldering glass at least to the cover, as an encircling bank, wherein the soldering glass is a pulverulent soldering glass which is tricked into position;
sintering-on the solder;
covering the substrate with the semiconductor component together with electrodes;
placing the cover onto the substrate; and
locally heating the soldering glass with a light source having a predetermined peak wavelength. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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Specification