Method and apparatus for inspecting printed circuit boards

• US 6,937,035 B2
• Filed: 07/19/2002
• Issued: 08/30/2005
• Est. Priority Date: 07/19/2001
• Status: Expired due to Fees

• Current Assignee: Omron Corporation
• Original Assignee: Omron Corporation
• Inventors: Ueda, Kenji, Matsui, Kenji, Kawaike, Noboru
• Primary Examiner(s): Tang, Minh N.
• Application Number:
  US10/198,739
• Publication Number:
  US 20030016026A1
• Time in Patent Office: 1,138 Days
• Field of Search: 324/247, 324/263, 324/512, 324/522, 324529-530, 324537-538, 324/750, 324/765, 324/158.1
• US Class Current: 324/754.29
• CPC Class Codes: G01R 31/315 by inductive methods

Abstract

A detection unit for detecting an electric field or a magnetic field is placed above a circuit to be detected. A control device allows the detection unit 4 to carry out detection processes while moving the detection unit in a predetermined direction with an electric current being applied to the circuit board so that an electric field distribution or a magnetic field distribution on the circuit board is detected. Moreover, the control device compares the results of the diction with reference data that has been preliminarily registered, and if there is any portion between the two pieces of data that is not coincident with each other, it is determined that the corresponding circuit board is a defective circuit board. Thus, it is possible to detect any defective portion on the printed circuit with high precision in a non-contact state to the circuit board.

Claims

1. A method for inspecting a printed circuit board comprising the steps of:

applying a current to said printed circuit board;

detecting a distribution state of a magnetic field generated by the current on said printed circuit board while varying relative positions to said printed circuit board with a non-contact state to said printed circuit board being maintained using a magnetic field sensing structure, the magnetic field sensing structure having multiple sensor units; and

determining whether or not any defect exists in said printed circuit board based upon the results of said detecting.

2. The method for inspecting a printed circuit board according to claim 1,

wherein said printed circuit board has an area including a wiring pattern or parts constituting at least redundant circuit as an object for inspection.

3. The method for inspecting a printed circuit board according claim 1,

wherein:

a detecting process is preliminarily carried out on a good circuit board without any defect under the same conditions as a circuit board that is an object for inspection so as to register the results of the inspection as reference data, and upon inspection, a determination is made as to whether or not any defect exists by comparing the results of inspection obtained with respect to an object for inspection with said reference data.

4. An apparatus for inspecting a printed circuit board comprising:

a detection unit which detects a distribution state of a magnetic field generated by the current on said printed circuit board while being set in a non-contact state with respect to said printed circuit board, the detection unit comprising a magnetic field sensing structure having multiple sensor units;

position adjusting means for adjusting a relative positional relationship between said detection unit and said printed circuit board; and

control means configured to control said position adjusting means to adjust the relative positional relationship between said detection unit and said printed circuit board while the detection unit detects the distribution state of a magnetic field so that a determination is made as to whether or not any defect exists in said printed circuit board by using detection signals from the detection unit corresponding to respective relative positions.