Probe card assembly for contacting a device with raised contact elements

• US 6,937,037 B2
• Filed: 07/16/2002
• Issued: 08/30/2005
• Est. Priority Date: 11/09/1995
• Status: Expired due to Fees

• Current Assignee: FormFactor Incorporated
• Original Assignee: FormFactor Incorporated
• Inventors: Mathieu, Gaetan L., Eldridge, Benjamin N., Grube, Gary W.
• Primary Examiner(s): Nguyen, Vinh P.
• Application Number:
  US10/198,198
• Publication Number:
  US 20030038647A1
• Time in Patent Office: 1,141 Days
• Field of Search: 324/754, 324/755, 324761-762, 324/765, 439 66- 72, 438 14- 18
• US Class Current: 324/754.07
• CPC Class Codes: B23K 20/004 Wire welding
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: G01R 1/06711 Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
• CPC Class Codes: G01R 1/06716 Elastic
• CPC Class Codes: G01R 1/07307 with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
• CPC Class Codes: G01R 1/07314 the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support on an elastic support, e.g. a film, G01R1/0735
• CPC Class Codes: G01R 1/07342 the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
• CPC Class Codes: G01R 1/07378 using an intermediate adapter, e.g. space transformers G01R1/07371 takes precedence
• CPC Class Codes: G01R 31/2884 using dedicated test connectors, test elements or test circuits on the IC under test G01R31/2855 takes precedence
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06
• CPC Class Codes: H01L 21/4853 Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/06136 Covering only the central area of the surface to be connected, i.e. central arrangements
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/73203 Bump and layer connectors
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 2224/85201 Compression bonding
• CPC Class Codes: H01L 23/49811 : Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 24/06 : of a plurality of bonding areas
• CPC Class Codes: H01L 24/11 : Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/72 : Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 25/0652 : the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 25/16 : the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0001 : Technical content checked by a classifier
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01022 : Titanium [Ti]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01045 : Rhodium [Rh]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H05K 1/141 : One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 2201/10318 : Surface mounted metallic pins
• CPC Class Codes: H05K 2201/10757 : Bent leads
• CPC Class Codes: H05K 2201/10878 : Means for retention of a lead in a hole
• CPC Class Codes: H05K 2201/10909 : Materials of terminal, e.g. of leads or electrodes of components
• CPC Class Codes: H05K 2201/10946 : Leads attached onto leadless component after manufacturing the component
• CPC Class Codes: H05K 3/20 : by affixing prefabricated conductor pattern H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence
• CPC Class Codes: H05K 3/326 : the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits H05K3/365 takes precedence
• CPC Class Codes: H05K 3/3421 : Leaded components
• CPC Class Codes: H05K 3/368 : parallel to each other H05K3/361 takes precedence
• CPC Class Codes: H05K 3/4015 : using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres

Abstract

A probe card is provided for probing a semiconductor wafer with raised contact elements. In particular, the present invention is useful with resilient contact elements, such as springs. A probe card is designed to have terminals to mate with the contact elements on the wafer. In a preferred embodiment, the terminals are posts. In a preferred embodiment the terminals include a contact material suitable for repeated contacts. In one particularly preferred embodiment, a space transformer is prepared with contact posts on one side and terminals on the opposing side. An interposer with spring contacts connects a contact on the opposing side of the space transformer to a corresponding terminal on a probe card, which terminal is in turn connected to a terminal which is connectable to a test device such as a conventional tester.

Claims

1. A probe card assembly comprising:

a probe card comprising a plurality of electrical contacts;

a probe substrate having a plurality of contact pads positioned for contacting raised contact elements of a device to be probed;

a second substrate disposed between and spaced from the probe card and the probe substrate; and

a plurality of elongate, resilient interconnection elements providing resilient electrical connections through the second substrate between the probe card and the probe substrate and thereby electrically connecting ones of the electrical contacts with ones of the contact pads.

2. The probe card assembly of claim 1, wherein the plurality of elongate interconnection elements extend from opposing surfaces of the second substrate.

3. The probe card assembly of claim 1, wherein each of the plurality of elongate interconnection elements is disposed such that each of the elongate interconnection element passes through an opening in the second substrate, opposite ends of each the elongate interconnection element being spaced from the opposing surfaces of the interconnect structure.

4. The probe card assembly of claim 1, wherein the plurality of elongate interconnection elements exert forces against the probe card and the probe substrate.

5. The probe card assembly of claim 4, wherein the forces are spring forces.

6. The probe card assembly of claim 1, wherein at least one of the elongate interconnection elements comprises a core of a first material and a coating of a second material, wherein the second material is more resilient than the first material.

7. The probe card assembly of claim 1, further comprising means for changing a planarity of the contact pads of the probe substrate.

8. The probe card assembly of claim 1, further comprising at least one moveable element disposed so as to change a planarity of the contact pads of the probe substrate.

9. The probe card assembly of claim 8, wherein the moveable element is threaded.

10. The probe card assembly of claim 8, wherein the moveable element comprises a screw.

11. The probe card assembly of claim 10, wherein the screw comprises a differential screw.

12. The probe card assembly of claim 1, further comprising at least one moveable element disposed so that movement of the element in a first direction causes at least a portion of the probe substrate to move toward the probe card.

13. The probe card assembly of claim 12, wherein movement of the moveable element in a second direction allows at least a portion of the probe substrate to move away from the probe card.

14. The probe card assembly of claim 1, further comprising a plurality of moveable elements, each disposed so as to affect a position of a portion of the probe substrate with respect to a portion of the probe card.

15. The probe card assembly of claim 1, wherein the probe substrate comprises a space transformer.

16. The probe card assembly of claim 1, wherein the plurality of contact pads comprise a plurality of posts each extending from the probe substrate.

17. The probe card assembly of claim 1, wherein a length by which each of the interconnection elements extends away from the second substrate is at least approximately twice a cross-sectional width of the interconnection element.

18. The probe card assembly of claim 1, wherein the interconnection elements are springs.

19. A probe card assembly comprising:

probe card means for providing electrical contacts to a tester;

probe substrate means for providing contact pad terminals to contact raised contact elements on a semiconductor device under test; and

interconnection means for flexibly connecting electrically the probe card means and the probe substrate means at a plurality of variations of a planar orientation of the probe substrate means with respect to the probe card means, wherein the interconnection means comprises a plurality of elongate interconnection elements for resiliently connecting electrically ones of the electrical contacts of the probe card means with ones of the contact pad terminals of the probe substrate means.

20. The probe card assembly of claim 19, further comprising means for changing a planarity of the contact pad terminals of the probe substrate means.

21. The probe card assembly of claim 19, wherein the interconnection elements are springs.

22. A probe card assembly comprising:

a probe card comprising a plurality of electrical contacts;

a probe substrate moveably attached to the probe card and comprising a plurality of contact pad elements, ones of the contact pad elements being in electrical communication with ones of the electrical contacts; and

a moveable element disposed so as to change a planar orientation of the probe substrate with respect to the probe card while the probe substrate is attached to the probe card.

23. The probe card assembly of claim 22, wherein movement of the moveable element in a first direction causes at least a portion of the probe substrate to move away from the probe card.

24. The probe card assembly of claim 22, wherein movement of the moveable element in a second direction allows at least a portion of the probe substrate to move toward the probe card.

25. The probe card assembly of claim 22, wherein the moveable element is threaded.

26. The probe card assembly of claim 22, wherein the moveable element comprises a screw.

27. The probe card assembly of claim 26, wherein the screw comprises a differential screw.

28. The probe card assembly of claim 22, further comprising a plurality of the moveable elements.

29. The probe card assembly of claim 22, wherein the probe substrate comprises a space transformer.

30. The probe card assembly of claim 22, wherein the contact pad elements comprise raised contact elements.

31. The probe card assembly of claim 22, wherein:

ends of the contact pad elements are disposed in a plane,

the planar orientation of the probe substrate comprises an angle of the plane with respect to a surface of the probe card, and

the movable element is disposed to change the angle.

32. The probe card assembly of claim 22, further comprising means for applying a biasing force biasing the probe substrate towards the probe card.

33. A probe card assembly comprising:

probe card means for providing an interface to a semiconductor tester;

substrate means for supporting a plurality of contact pad probe elements, the probe elements being in electrical communication with the probe card means, the probe substrate means being moveably attached to the probe card means; and

means for changing a planar orientation of the substrate means with respect to the probe card means while the substrate means is attached to the probe card means.

34. The probe card assembly of claim 33, wherein the probe elements comprise posts.

35. The probe card assembly of claim 33, further comprising interposer means disposed between the probe card means and the substrate means for exerting forces against the probe card means and the substrate means.

36. The probe card assembly of claim 33, wherein:

contact portions of the probe elements are disposed in a plane,

the planar orientation of the substrate means comprises an angle of the plane with respect to a surface of the probe card means, and

the means for changing changes the angle.

37. The probe card assembly of claim 33 further comprising means for applying a biasing force biasing the substrate means towards the probe card means.