Electronic component mounting method

• US 6,938,335 B2
• Filed: 05/24/2002
• Issued: 09/06/2005
• Est. Priority Date: 12/13/1996
• Status: Expired due to Fees

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Kuribayashi, Takeshi, Nakano, Kazuyuki
• Primary Examiner(s): Trinh, Minh
• Assistant Examiner(s): Nguyen, Donghai D.
• Application Number:
  US10/153,673
• Publication Number:
  US 20020194729A1
• Time in Patent Office: 1,201 Days
• Field of Search: 29464-468, 29720-721, 297/44, 29830-836, 298/42, 298/46, 297/40, 174/52.2, 174/52.3, 174/52.4, 174/260, 174/261, 257/777, 257/786, 257/797, 361/767, 361/768, 361/777, 361/782, 361/783, 361/787, 361/808, 361/811, 382/145, 382/151, 438/16, 438/108
• US Class Current: 29/834
• CPC Class Codes: H01L 2224/81 using a bump connector
• CPC Class Codes: H05K 1/0266 Marks, test patterns or identification means
• CPC Class Codes: H05K 13/0815 Controlling of component placement on the substrate during or after manufacturing
• CPC Class Codes: H05K 3/303 Surface mounted components, e.g. affixing before soldering, aligning means, spacing means H05K3/32 takes precedence
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49131 by utilizing optical sighting device
• CPC Class Codes: Y10T 29/49133 with component orienting
• CPC Class Codes: Y10T 29/49137 Different components
• CPC Class Codes: Y10T 29/53087 with signal, scale, illuminator, or optical viewer
• CPC Class Codes: Y10T 29/53178 Chip component
• CPC Class Codes: Y10T 29/53196 Means to apply magnetic force directly to position or hold work part

Abstract

A component mounting method recognizes reference marks on a printed circuit board and an electronic component, and uses these reference marks to determine a shift between a position of the circuit board and a position of the electronic component. This shift is corrected and then the electronic component is mounted to the printed circuit board such that electrical connecting portions of the circuit board are connected to electrical connecting portions of the electronic component. The reference marks are formed simultaneously with corresponding electrical connecting portions via a mask, such that in order to accurately position the electrical connecting portions, it is only necessary to accurately relatively position the reference marks.

Claims

1. An electronic component mounting method comprising:

recognizing a first reference mark on a printed circuit board having thereon at least one first electrical connecting portion, with a position of said at least one first electrical connecting portion being defined based on said first reference mark, and with said first reference mark and said at least one first electrical connecting portion being simultaneously formed on said printed circuit board via a mask;

recognizing a second reference mark on a first electronic component having thereon at least one second electrical connecting portion, with a position of said at least one second electrical connecting portion being defined based on said second reference mark, and with said second reference mark and said at least one second electrical connecting portion being simultaneously formed on said first electronic component via a mask;

determining a shift between a position of said printed circuit board and a position of said first electronic component based on the recognition of said first and second reference marks;

correcting the shift between the position of said printed circuit board and the position of said first electronic component, and mounting said first electronic component to said printed circuit board;

recognizing a third reference mark on a second electronic component having thereon at least one third electrical connecting portion, with a position of said at least one third electrical connecting portion being defined based on said third reference mark, and with said third reference mark and said at least one third electrical connecting portion being simultaneously formed on said second electronic component via a mask;

recognizing a fourth reference mark on said first electronic component, wherein said first electronic component also has thereon at least one fourth electrical connecting portion, with a position of said at least one fourth electrical connecting portion being defined based on said fourth reference mark, and with said fourth reference mark and said at least one fourth electrical connecting portion being simultaneously formed on said first electronic component via a mask;

determining a shift between a position of said second electronic component and a position of said first electronic component based on the recognition of said third and fourth reference marks; and

correcting the shift between the position of said second electronic component and the position of said first electronic component, and mounting said second electronic component to said first electronic component.

2. The electronic component mounting method according to claim 1, wherein

said first reference mark and said at least one first electrical connecting portion are formed on one surface of said printed circuit board,

said second reference mark and said at least one second electrical connecting portion are formed on one surface of said first electronic component,

said third reference mark and said at least one third electrical connecting portion are formed on one surface of said second electronic component, and

said fourth reference mark and said at least one fourth electrical connecting portion are formed on another surface of said first electronic component.

3. The electronic component mounting method according to claim 2, wherein

said one surface of said printed circuit board is an upper surface of said printed circuit board,

said one surface of said first electronic component is a lower surface of said first electronic component,

said another surface of said first electronic component is an upper surface of said first electronic component, and

said one surface of said second electronic component is a lower surface of said second electronic component.

4. The electronic component mounting method according to claim 3, wherein

said at least one first electrical connecting portion comprises plural first electrical connecting portions,

said at least one second electrical connecting portion comprises plural second electrical connecting portions,

said at least one third electrical connecting portion comprises plural third electrical connecting portions, and

said at least one fourth electrical connecting portion comprises plural fourth electrical connecting portions.

5. The electronic component mounting method according to claim 4, wherein

recognizing said first reference mark on said printed circuit board comprises using a first focal length of a camera to recognize said first reference mark, and

recognizing said second reference mark on said first electronic component comprises using a second focal length of said camera to recognize said second reference mark,

with said first focal length being greater than said second focal length.

6. The electronic component mounting method according to claim 5, further comprising:

after using said first focal length of said camera to recognize said first reference mark, changing the focal length of said camera to said second focal length without changing a distance from said camera to said printed circuit board, which second focal length is then used to recognize said second reference mark.

7. The electronic component mounting method according to claim 6, wherein

mounting said first electronic component to said printed circuit board comprises mounting said plural first electrical connecting portions to said plural second electrical connecting portions, and

mounting said second electronic component to said first electronic component comprises mounting said plural third electrical connecting portions to said plural fourth electrical connecting portions.

8. The electronic component mounting method according to claim 2, wherein

recognizing said first reference mark on said printed circuit board comprises using a first focal length of a camera to recognize said first reference mark, and

recognizing said second reference mark on said first electronic component comprises using a second focal length of said camera to recognize said second reference mark,

with said first focal length being greater than said second focal length.

9. The electronic component mounting method according to claim 1, wherein

said at least one first electrical connecting portion comprises plural first electrical connecting portions,

said at least one second electrical connecting portion comprises plural second electrical connecting portions,

said at least one third electrical connecting portion comprises plural third electrical connecting portions, and

said at least one fourth electrical connecting portion comprises plural fourth electrical connecting portions.

10. The electronic component mounting method according to claim 9, wherein

recognizing said first reference mark on said printed circuit board comprises using a first focal length of a camera to recognize said first reference mark, and

recognizing said second reference mark on said first electronic component comprises using a second focal length of said camera to recognize said second reference mark,

with said first focal length being greater than said second focal length.

11. The electronic component mounting method according to claim 10, further comprising:

after using said first focal length of said camera to recognize said first reference mark, changing the focal length of said camera to said second focal length without changing a distance from said camera to said printed circuit hoard, which second focal length is then used to recognize said second reference mark.

12. The electronic component mounting method according to claim 9, wherein

said first reference mark and said plural first electrical connecting portions are formed on one surface of said printed circuit board,

said second reference mark and said plural second electrical connecting portions are formed on one surface of said first electronic component,

said third reference mark and said plural third electrical connecting portions are formed on one surface of said second electronic component, and

said fourth reference mark and said plural fourth electrical connecting portions are formed on another surface of said first electronic component.

13. The electronic component mounting method according to claim 1, wherein

mounting said first electronic component to said printed circuit board comprises mounting said at least one first electrical connecting portion to said at least one second electrical connecting portion, and

mounting said second electronic component to said first electronic component comprises mounting said at least one third electrical connecting portion to said at least one fourth electrical connecting portion.

14. The electronic component mounting method according to claim 13, wherein

said at least one first electrical connecting portion comprises plural first electrical connecting portions,

said at least one second electrical connecting portion comprises plural second electrical connecting portions,

said at least one third electrical connecting portion comprises plural third electrical connecting portions, and

said at least one fourth electrical connecting portion comprises plural fourth electrical connecting portions.

15. The electronic component mounting method according to claim 13, wherein

recognizing said first reference mark on said printed circuit board comprises using a first focal length of a camera to recognize said first reference mark, and

recognizing said second reference mark on said first electronic component comprises using a second focal length of said camera to recognize said second reference mark,

with said first focal length being greater than said second focal length.

16. The electronic component mounting method according to claim 15, further comprising:

after using said first focal length of said camera to recognize said first reference mark, changing the focal length of said camera to said second focal length without changing a distance from said camera to said printed circuit board, which second focal length is then used to recognize said second reference mark.

17. The electronic component mounting method according to claim 13, wherein

said first reference mark and said at least one first electrical connecting portion are formed on one surface of said printed circuit board,

said second reference mark and said at least one second electrical connecting portion are formed on one surface of said first electronic component,

said third reference mark and said at least one third electrical connecting portion are formed on one surface of said second electronic component, and

said fourth reference mark and said at least one fourth electrical connecting portion are formed on another surface of said first electronic component.

18. The electronic component mounting method according to claim 17, wherein

said one surface of said printed circuit board is an upper surface of said printed circuit board,

said one surface of said first electronic component is a lower surface of said first electronic component,

said another surface of said first electronic component is an upper surface of said first electronic component, and

said one surface of said second electronic component is a lower surface of said second electronic component.

19. The electronic component mounting method according to claim 1, wherein

recognizing said first reference mark on said printed circuit board comprises using a first focal length of a camera to recognize said first reference mark, and

recognizing said second reference mark on said first electronic component comprises using a second focal length of said camera to recognize said second reference mark,

with said first focal length being greater than said second focal length.

20. The electronic component mounting method according to claim 19, further comprising:

after using said first focal length of said camera to recognize said first reference mark, changing the focal length of said camera to said second focal length without changing a distance from said camera to said printed circuit board, which second focal length is then used to recognize said second reference mark.