Polishing apparatus

• US 6,939,208 B2
• Filed: 01/22/2001
• Issued: 09/06/2005
• Est. Priority Date: 10/24/2000
• Status: Expired due to Term

• Current Assignee: Ebara Corporation
• Original Assignee: Ebara Corporation
• Inventors: Kimura, Norio, Kamimura, Kenji, Tsujimura, Manabu, Okamura, Satoshi, Aizawa, Hideo, Matsuo, Hisanori, Akagi, Makoto, Tokushige, Katsuhiko
• Primary Examiner(s): Rose, Robert A.
• Application Number:
  US09/787,121
• Publication Number:
  US 20020164932A1
• Time in Patent Office: 1,688 Days
• Field of Search: 451/56, 451/72, 451/444, 451/443, 451/288, 451/5, 451/21, 451/65
• US Class Current: 451/56
• CPC Class Codes: B24B 29/005 using brushes
• CPC Class Codes: B24B 53/003 using at least two conditioning tools
• CPC Class Codes: B24B 53/017 Devices or means for dressing, cleaning or otherwise conditioning lapping tools
• CPC Class Codes: H01L 21/30625 With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Abstract

The present invention relates to a polishing apparatus for polishing a workpiece, such as a semiconductor wafer, to a flat mirror finish. The polishing apparatus comprises a polishing table having a polishing surface, and a top ring, and the workpiece is interposed between the polishing table and the top ring, and pressed at a predetermined pressure to polish the workpiece. The polishing apparatus comprises at least two dressing units for dressing the polishing surface by being brought into contact with the ppolishing surface, which is a surface of a polishing cloth.

Claims

1. A polishing apparatus for polishing a workpiece, comprising:

a table for providing a polishing surface;

a first dresser having a contact surface for contacting said polishing surface during a first dressing operation;

a second dresser having a contact surface for contacting said polishing surface during a second dressing operation;

a sensor for measuring a profile of said polishing surface; and

a controller for controlling a dressing process of said first dresser,

wherein said first dresser and said second dresser are to perform said first dressing operation and said second dressing operation at different times, respectively.

2. A polishing apparatus comprising:

a polishing table having a polishing surface;

a top ring for pressing a workpiece against said polishing surface so as to polish the workpiece;

at least two dressers for dressing said polishing surface, one of said at least two dressers comprising a diamond dresser; and

a controller for performing an initial surface conditioning of said polishing surface with said one of said at least two dressers at a time prior to polishing of any workpiece so as to thinly shave said polishing surface, and for dressing said polishing surface with another of said at least two dressers after the workpiece has been polished.

3. The polishing apparatus according to claim 2, wherein

said one of said at least two dressers is for performing the initial surface conditioning of said polishing surface only at the time prior to polishing of any workpiece, and

said another of said at least two dressers is for dressing said polishing surface only after a workpiece has been polished.

4. The polishing apparatus according to claim 2, wherein

said at least two dressers are different in size relative to one another.

6. The polishing apparatus according to claim 2, wherein

one of said at least two dressers is to move across said polishing surface while dressing said polishing surface.

7. The polishing apparatus according to claim 2, wherein

at least one of said at least two dressers is to dress said polishing surface while the workpiece is not being polished.

8. The polishing apparatus according to claim 2, wherein

said at least two dressers comprise diamond dressers.

9. The polishing apparatus according to claim 2, wherein

said another of said at least two dressers comprises a brush dresser.

13. The polishing apparatus according to claim 2, wherein

said one of said at least two dressers is to dress said polishing surface when a polishing performance is not properly maintained.

14. The polishing apparatus according to claim 13, wherein

said one of said at least two dressers is to dress said polishing surface when the polishing performance is determined to not be properly maintained based on a profile of a surface, to be polished, of the workpiece not meeting a predetermined level requirement.

15. The polishing apparatus according to claim 2, further comprising:

an atomizer for spraying a fluid onto said polishing surface so as to remove a polishing waste present on said polishing surface.

16. The polishing apparatus according to claim 15, wherein

said atomizer is to spray a fluid composed of a mixture of gas and liquid.

17. The polishing apparatus according to claim 15, wherein

said atomizer is for spraying the fluid onto said polishing surface while the workpiece is not being polished.

18. The polishing apparatus according to claim 15, wherein

said atomizer is for spraying the fluid onto said polishing surface while said polishing surface is being dressed.

5. A polishing apparatus comprising:

a polishing table having a polishing surface;

a top ring for pressing a workpiece against said polishing surface so as to polish the workpiece; and

at least two dressers for dressing said polishing surface,

wherein one of said at least two dressers is to perform an initial surface conditioning of said polishing surface at a time prior to polishing of any workpiece, and another of said at least two dressers is for dressing said polishing surface after the workpiece has been polished,

wherein at least one of said at least two dressers has a diameter greater than a diameter of the workpiece to be polished, and

wherein at least one of said at least two dressers has a diameter smaller than the diameter of the workpiece to be polished.

10. A polishing apparatus comprising:

a polishing table having a polishing surface;

a top ring for pressing a workpiece against said polishing surface so as to polish the workpiece; and

at least two dressers for dressing said polishing surface,

wherein one of said at least two dressers is to perform an initial surface conditioning of said polishing surface at a time prior to polishing of any workpiece, and another of said at least two dressers is for dressing said polishing surface after the workpiece has been polished, and

wherein one of said at least two dressers is to have at least one of its swing speed, rotational speed, and pressing load controlled based on a profile of a surface, to be polished, of the workpiece.

11. A polishing apparatus comprising:

a polishing table having a polishing surface;

a top ring for pressing a workpiece against said polishing surface so as to polish the workpiece; and

at least two dressers for dressing said polishing surface,

wherein one of said at least two dressers is to perform an initial surface conditioning of said polishing surface at a time prior to polishing of any workpiece, and another of said at least two dressers is for dressing said polishing surface after the workpiece has been polished, and

wherein one of said at least two dressers is to have at least one of its swing speed, rotational speed, and pressing load controlled based on a profile of said polishing surface.

12. A polishing apparatus comprising:

a polishing table having a polishing surface;

a top ring for pressing a workpiece against said polishing surface so as to polish the workpiece;

at least two dressers for dressing said polishing surface, with one of said at least two dressers comprising a diamond dresser; and

a controller for performing a dressing operation with said one of said at least two dressers after a plurality of workpieces has been polished, and for dressing said polishing surface with another of said at least two dressers each time a workpiece has been polished.