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Method of making an X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging

  • US 6,939,473 B2
  • Filed: 10/20/2003
  • Issued: 09/06/2005
  • Est. Priority Date: 10/20/2003
  • Status: Active Grant
First Claim
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1. A method for manufacturing a sensor for measuring angular velocity in a sensing plane, the method comprising:

  • a) etching a sensing subassembly from a gyroscope wafer, the subassembly comprising;

    i) a substantially planar frame parallel to said plane; and

    ii) a linkage connected to said frame and comprising a first mass and a second mass laterally disposed in said plane, wherein the first mass and the second mass are connected together. constrained to move in opposite directions perpendicular to said plane;

    b) providing an actuator for driving a first portion of said subassembly into oscillation at a drive frequency; and

    c) providing a transducer for sensing motion of a second portion of said subassembly responsive to said angular velocity.

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