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Thick film conductor compositions for use in membrane switch applications

  • US 6,939,484 B2
  • Filed: 12/04/2003
  • Issued: 09/06/2005
  • Est. Priority Date: 12/04/2003
  • Status: Active Grant
First Claim
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1. A thick film conductor composition comprising:

  • a) electrically conductive silver powder;

    b) PVDF/HFP polymer resin, copolymers of a PVDF/HFP polymer resin, and mixtures thereof;

    dissolved inc) organic solvent;

    with the provisos that the PVDF/HFP resin has a melt viscosity of 0.2–

    0.7 kPoise and a DSC melt temperature in the range of 85–

    98°

    C.

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