Method of manufacturing a semiconductor component that includes self-aligning a gate electrode to a field plate
First Claim
1. A method of manufacturing a semiconductor component, the method comprising:
- providing a semiconductor substrate;
forming a first dielectric layer above the semiconductor substrate;
forming a field plate above the first dielectric layer;
self-aligning a gate electrode to the field plate; and
forming a first ohmic contact region and a second ohmic contact region above the semiconductor substrate, wherein;
self-aligning the gate electrode to the field plate further comprises;
forming the gate electrode after forming the first ohmic contact region and the second ohmic contact region; and
forming the gate electrode to be between the first ohmic contact region and the second ohmic contact region.
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Abstract
In one embodiment of the invention, a semiconductor component includes a semiconductor substrate (110), a first dielectric layer (120) above the semiconductor substrate, a first ohmic contact region (410) and a second ohmic contact region (420) above the semiconductor substrate, a gate electrode (1120) above the semiconductor substrate and between the first ohmic contact region and the second ohmic contact region, a field plate (210) above the first dielectric layer and between the gate electrode and the second ohmic contact region, a second dielectric layer (310) above the field plate, the first dielectric layer, the first ohmic contact region, and the second ohmic contact region, and a third dielectric layer (910) between the gate electrode and the field plate and not located above the gate electrode or the field plate.
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Citations
17 Claims
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1. A method of manufacturing a semiconductor component, the method comprising:
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providing a semiconductor substrate;
forming a first dielectric layer above the semiconductor substrate;
forming a field plate above the first dielectric layer;
self-aligning a gate electrode to the field plate; and
forming a first ohmic contact region and a second ohmic contact region above the semiconductor substrate, wherein;
self-aligning the gate electrode to the field plate further comprises;
forming the gate electrode after forming the first ohmic contact region and the second ohmic contact region; and
forming the gate electrode to be between the first ohmic contact region and the second ohmic contact region. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method of manufacturing a semiconductor component, the method comprising:
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providing a semiconductor substrate;
forming a first dielectric layer above the semiconductor substrate;
forming a field plate above the first dielectric layer;
self-aligning a gate electrode to the field plate;
forming a semiconductor layer above the semiconductor substrate before forming the first dielectric layer; and
forming a gate recess in the semiconductor layer, wherein;
forming the first dielectric layer comprises;
forming the first dielectric layer above the semiconductor layer.
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8. A method of manufacturing a semiconductor component, the method comprising:
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providing a semiconductor substrate;
forming a first dielectric layer above the semiconductor substrate;
forming a field plate above the first dielectric layer; and
self-aligning a gate electrode to the field plate, wherein;
self aligning the gate electrode to the field plate further comprises;
forming a second dielectric layer above the field plate and the first dielectric layer;
forming a hole through the second dielectric layer to expose a portion of the field plate;
removing the portion of the field plate;
removing a portion of the first dielectric layer;
depositing a third dielectric layer over the second dielectric layer and in the hole;
etching the third dielectric layer to form a spacer inside the hole; and
forming the gate electrode in the hole; and
forming the second dielectric layer comprises;
forming the second dielectric layer to comprise;
a first tetra-ethyl-ortho-silicate layer;
an aluminum-nitride layer; and
a second tetra-ethyl-ortho-silicate layer. - View Dependent Claims (9, 10, 11)
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12. A method of manufacturing a semiconductor component, the method comprising:
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providing a semiconductor substrate;
forming a first dielectric layer above the semiconductor substrate;
forming a field plate above the first dielectric layer; and
self-aligning a gate electrode to the field plate, wherein;
forming the first dielectric layer comprises;
forming the first dielectric layer to comprise;
a silicon-nitride layer; and
an aluminum-nitride layer.
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13. A method of manufacturing a semiconductor component, the method
comprising: -
providing a semiconductor substrate;
forming a first dielectric layer above the semiconductor substrate;
forming a field plate comprising titanium tungsten nitride above the first dielectric layer;
simultaneously forming a first ohmic contact region and a second ohmic contact region above the semiconductor substrate;
forming a second dielectric layer above the field plate, the first dielectric layer, the first ohmic contact region, and the second ohmic contact region;
forming a hole in the second dielectric layer and between the first ohmic contact region and the second ohmic contact region to expose a portion of the field plate;
removing the portion of the field plate;
removing a portion of the first dielectric layer;
depositing a third dielectric layer over the second dielectric layer and in the hole;
etching the third dielectric layer to form a spacer inside the hole; and
forming a T-gate electrode in and over the hole;
wherein;
the spacer isolates the field plate from the T-gate electrode. - View Dependent Claims (14, 15, 16, 17)
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Specification