Flip-chip image sensor packages and methods of fabrication
First Claim
1. An electronic device package comprising:
- a transparent substrate structure;
at least one secondary substrate having a first surface secured to a surface of the transparent substrate structure, a central aperture covered by the transparent substrate structure, and a plurality of conductive traces formed around the central aperture, each conductive trace of the plurality of conductive traces having a first attachment point and a second attachment point on a second surface of the at least one secondary substrate;
at least one optically interactive electronic device having at least one bond pad, the at least one optically interactive electronic device mounted to the at least one secondary substrate by a bond between the first attachment point of a conductive trace of the plurality of conductive traces and the at least one bond pad; and
a discrete conductive element attached to the second attachment point of the conductive trace, the discrete conductive element extending outwardly from the at least one secondary substrate within an outside perimeter thereof from the second attachment point in a direction perpendicular to a plane of the at least one secondary substrate and to a level beyond a back surface of the at least one optically interactive electronic device.
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Accused Products
Abstract
The present invention provides flip-chip packaging for optically interactive devices such as images sensors and methods of assembly. In a first embodiment of the invention, conductive traces are formed directly on the second surface of a transparent substrate and an image sensor chip is bonded to the conductive traces. Discrete conductive elements are attached to the conductive traces and extend below a back surface of the image sensor chip. In a second embodiment, a secondary substrate having conductive traces formed thereon is secured to the transparent substrate. In a third embodiment, a backing cap having a full array of attachment pads is attached to the transparent substrate of the first embodiment or the secondary substrate of the second embodiment. In a fourth embodiment, the secondary substrate is a flex circuit having a mounting portion secured to the second surface of the transparent substrate and a backing portion bent over adjacent to the back surface of the image sensor chip.
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Citations
10 Claims
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1. An electronic device package comprising:
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a transparent substrate structure;
at least one secondary substrate having a first surface secured to a surface of the transparent substrate structure, a central aperture covered by the transparent substrate structure, and a plurality of conductive traces formed around the central aperture, each conductive trace of the plurality of conductive traces having a first attachment point and a second attachment point on a second surface of the at least one secondary substrate;
at least one optically interactive electronic device having at least one bond pad, the at least one optically interactive electronic device mounted to the at least one secondary substrate by a bond between the first attachment point of a conductive trace of the plurality of conductive traces and the at least one bond pad; and
a discrete conductive element attached to the second attachment point of the conductive trace, the discrete conductive element extending outwardly from the at least one secondary substrate within an outside perimeter thereof from the second attachment point in a direction perpendicular to a plane of the at least one secondary substrate and to a level beyond a back surface of the at least one optically interactive electronic device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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Specification