Transponder

• US 6,940,455 B2
• Filed: 03/13/2001
• Issued: 09/06/2005
• Est. Priority Date: 03/16/2000
• Status: Expired due to Fees

• Current Assignee: Andreas Plettner
• Original Assignee: Andreas Plettner
• Inventors: Plettner, Andreas
• Primary Examiner(s): PHAN, THO GIA
• Application Number:
  US09/805,733
• Publication Number:
  US 20010053675A1
• Time in Patent Office: 1,638 Days
• Field of Search: 343/700.MS, 343/793, 343/795, 340/572.1, 340/572.7, 340/572.8, 455/39, 455/91
• US Class Current: 343/700.0MS
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: G06K 19/07786 the antenna being of the HF type, such as a dipole
• CPC Class Codes: G06K 19/07788 the antenna being of the capacitive type
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/36 Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewithH01Q1/08, H01Q1/14 take precedence
• CPC Class Codes: H01Q 9/285 Planar dipole H01Q9/065 takes precedence; patch antenna H01Q9/0407

Abstract

A transponder comprising a chip having contact pads and at least two coupling elements, which are conductively connected with the contact pads, wherein the coupling elements are touch-free relative to each other and formed in a self-supported as well as free-standing way and are essentially extended parallel to the chip plane, the total mounting height of the transponder corresponds essentially to the mounting height of the chip, and the coupling elements are in geometry and size adapted for acting as a dipole antenna or in conjunction with an evaluation unit as a plate capacitor.

Claims

1. A transponder comprising:

a chip having contact pads; and

at least two coupling elements conductively connected with the contact pads wherein;

the coupling elements are touch-free relative to each other and formed in a self-supported as well as free-standing way and are essentially extended parallel to a plane of the chip;

a total mounting height of the transponder corresponds essentially to a mounting height of the chip; and

the coupling elements have a geometry and size so as to be configurable for use as a dipole antenna or for use as a plate capacitor in conjunction with an evaluation unit.

2. The transponder of claim 1 wherein the connection of the coupling elements with the contact pads is performed on a wafer.

3. The transponder of claim 1 wherein the coupling elements are formed in a meandrous way.

4. The transponder of claim 3 wherein the connection of the coupling elements with the contact pads is performed on a wafer.

5. The transponder of claim 1 wherein the dipole antenna has a working frequency of at least 2.45 GHz.

6. The transponder of claim 5 wherein the connection of the coupling elements with the contact pads is performed on a wafer.

7. The transponder of claim 5 wherein the coupling elements are formed in a meandrous way.

8. The transponder of claim 7 wherein the connection of the coupling elements with the contact pads is performed on a wafer.

9. The transponder of claim 1 wherein the dipole antenna has a working frequency of at least 24.125 GHz.

10. The transponder of claim 9 wherein the dipole antenna has a meandrous configuration.

11. A transponder comprising:

a chip having a contact pad; and

a coupling element conductively connected with the contact pad, wherein;

the coupling element is formed in a self-supported as well as free-standing way and is essentially extended parallel to a plane of the chip;

a total mounting height of the transponder corresponds essentially to a mounting height of the chip; and

the coupling element is configured in geometry and size as a plate capacitor for use in conjunction with an evaluation unit.

12. The transponder of claim 11 wherein the connection of the coupling element with the contact pad is performed on a wafer.

13. A transponder comprising:

a chip having at least two contact pads; and

at least two coupling elements, each coupling element self-supporting and free-standing with respect to the other and each coupling element electrically connected to a respective contact pad on the chip, wherein the at least two coupling elements are configured as a dipole extending parallel to a plane of the chip and a mounting height of the transponder is approximately a mounting height of the chip.

14. The transponder of claim 13 wherein the at least two coupling elements are connected to the respective contact pad on a wafer level.

15. The transponder of claim 13 wherein the at least two coupling elements have a meandrous configuration.

16. The transponder of claim 13 wherein the dipole has a working frequency of at least 2.45 GHz.

17. The transponder of claim 13 wherein the dipole has a working frequency of at least 24.125 GHz.

18. The transponder of claim 13 wherein the at least two coupling elements:

are connected to the respective contact pad on a wafer level; and

have a meandrous configuration.

19. The transponder of claim 18 wherein the dipole has a working frequency of at least 24.125 GHz.

20. The transponder of claim 18 wherein the dipole has a working frequency of at least 2.45 GHz.