Semiconductor light emitting device
First Claim
1. A light emitting diode comprising:
- a first metal lead having mass sufficient to provide low thermal resistance including at least one anode contact pad and at least one anode contact for electrical connection to a circuit board;
a second metal lead having mass sufficient to provide low thermal resistance including at least one cathode contact pad and at least one cathode contact for electrical connection to said circuit board;
said cathode contact pad and said cathode contact comprised of a contiguous metal lead and said anode contact pad and said anode contact comprised of a contiguous metal lead;
a reflector;
a semiconductor die, comprising a transparent substrate and a light emitting component, wherein the semiconductor die connects to the metal lead frame via at least two solder bridges positioned between said anode contact pad and said cathode contact pad over the reflector; and
, said electrical connection of said circuit board to said semiconductor die being free of wire bond attachment.
1 Assignment
0 Petitions
Accused Products
Abstract
A light emitting diode (LED) including a combination of features that enable the LED to produce a high-brightness predetermined radiation pattern. The combination of features enable the LED to function cooler and more reliably at a higher drive currents and elevated ambient temperatures, and therefore emit light of increased brightness, without overheating, and to have a particular radiation pattern. In particular, a surface mount that is capable of operating at high drive currents and high ambient temperatures is disclosed. The LED comprises a surface mount package having a metal lead frame having mass sufficient to provide low thermal resistance, at least one anode contact pad and at least one cathode contact pad. The LED also includes a reflector positioned within the package, a semiconductor die and an optional focusing dome. The semiconductor die comprises a transparent substrate and a semiconductor component and is positioned within the package so that the semiconductor component and the substrate are arranged side-by-side over the reflector (flop-chip). Alternatively, the die is positioned within the package so that the substrate is on top of the semiconductor component (flip-chip). The optional focusing dome is operative to refract light emitted from the semiconductor die and light reflected from the reflector to create a predetermined radiation pattern.
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Citations
12 Claims
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1. A light emitting diode comprising:
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a first metal lead having mass sufficient to provide low thermal resistance including at least one anode contact pad and at least one anode contact for electrical connection to a circuit board;
a second metal lead having mass sufficient to provide low thermal resistance including at least one cathode contact pad and at least one cathode contact for electrical connection to said circuit board;
said cathode contact pad and said cathode contact comprised of a contiguous metal lead and said anode contact pad and said anode contact comprised of a contiguous metal lead;
a reflector;
a semiconductor die, comprising a transparent substrate and a light emitting component, wherein the semiconductor die connects to the metal lead frame via at least two solder bridges positioned between said anode contact pad and said cathode contact pad over the reflector; and
,said electrical connection of said circuit board to said semiconductor die being free of wire bond attachment. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A light emitting diode comprising:
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a first metal lead having mass sufficient to provide low thermal resistance including at least one anode contact pad and at least one anode contact for electrical connection to a circuit board;
a second metal lead having mass sufficient to provide low thermal resistance including at least one cathode contact pad and at least one cathode contact for electrical connection to said circuit board;
said cathode contact pad and said cathode contact being comprised of a contiguous metal lead and said anode contact pad and said anode being comprised of a contiguous metal lead;
a semiconductor die comprising a transparent substrate and a light emitting region, wherein the transparent substrate connects to the metal lead frame via a solder bridge between one of said anode contact pad and said cathode contact pad, and said light emitting region connects to the metal lead frame via a solder bridge between the other of said anode contact pad and said cathode contact pad; and
,said electrical connection of said circuit board to said semiconductor die being free of wire bond attachment.
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Specification