Method for evaluating pattern defects on a water surface
First Claim
1. A method for evaluating pattern defects on a wafer surface comprising the following steps:
- acquiring surface data of a plurality of differently located individual image fields of the wafer surface;
comparing the surface data of each individual image field to a reference datum from a reference data set in which all the previously acquired surface data of the identically located individual image fields of other wafers having the same pattern are stored;
ascertaining deviations as a result of the comparison;
classifying the deviations into critical and noncritical defects; and
outputting advisories as to the individual image fields of the wafer surface having critical defects.
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Abstract
The invention concerns a method for evaluating pattern defects on a wafer surface, comprising the following steps: acquiring the surface data of a plurality of individual image fields (4) of a series-produced wafer (1); storing the data in a reference data set and making it available as reference data for the inspection of further wafers of the same series; inspecting, successively in time, the individual image fields (4) on the surface of a wafer (1) presently being examined; retrieving from the reference data set a reference datum corresponding to the respective individual image field (4) presently being inspected; comparing the surface of each individual image field (4) currently being inspected to the corresponding reference datum; if one or more deviations are identified, subsequently classifying the deviations into critical and noncritical defects in terms of the functionality of the chip; and simultaneously updating or adding to the reference data set.
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Citations
18 Claims
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1. A method for evaluating pattern defects on a wafer surface comprising the following steps:
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acquiring surface data of a plurality of differently located individual image fields of the wafer surface;
comparing the surface data of each individual image field to a reference datum from a reference data set in which all the previously acquired surface data of the identically located individual image fields of other wafers having the same pattern are stored;
ascertaining deviations as a result of the comparison;
classifying the deviations into critical and noncritical defects; and
outputting advisories as to the individual image fields of the wafer surface having critical defects. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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Specification