Microstructure relay switches

• US 6,941,036 B2
• Filed: 02/13/2003
• Issued: 09/06/2005
• Est. Priority Date: 12/21/2000
• Status: Expired due to Fees

• Current Assignee: Bernardo F. Lucero
• Original Assignee: Bernardo F. Lucero
• Inventors: Lucero, Bernardo F.
• Primary Examiner(s): HEALY, BRIAN
• Application Number:
  US10/366,858
• Publication Number:
  US 20040013342A1
• Time in Patent Office: 936 Days
• Field of Search: 385/14, 385/15, 385/16, 385/17, 385/18, 385/24, 385/12, 385/13, 385/25, 385/22
• US Class Current: 385/22
• CPC Class Codes: G02B 2006/12104 Mirror; Reflectors or the like
• CPC Class Codes: G02B 2006/12159 Interferometer
• CPC Class Codes: G02B 2006/12176 Etching
• CPC Class Codes: G02B 6/12004 Combinations of two or more optical elements
• CPC Class Codes: G02B 6/12007 forming wavelength selective elements, e.g. multiplexer, demultiplexer
• CPC Class Codes: G02B 6/122 Basic optical elements, e.g. light-guiding paths
• CPC Class Codes: G02B 6/266 the optical element being an attenuator
• CPC Class Codes: G02B 6/2746 comprising non-reciprocal devices, e.g. isolators, FRM, circulators, quasi-isolators magneto-optic non-reciprocal devices G02F1/093
• CPC Class Codes: G02B 6/2817 using reflective elements to split or combine optical signals
• CPC Class Codes: G02B 6/3514 the reflective optical element moving along a line so as to translate into and out of the beam path, i.e. across the beam path
• CPC Class Codes: G02B 6/352 the reflective optical element having a shaped reflective surface, e.g. a reflective element comprising several reflective surfaces or facets that function together
• CPC Class Codes: G02B 6/3526 the optical element being a lens
• CPC Class Codes: G02B 6/3528 the optical element being a prism
• CPC Class Codes: G02B 6/3534 the optical element being diffractive, i.e. a grating
• CPC Class Codes: G02B 6/3546 NxM switch, i.e. a regular array of switches elements of matrix type constellation
• CPC Class Codes: G02B 6/355 1x2 switch, i.e. one input and a selectable single output of two possible outputs
• CPC Class Codes: G02B 6/3584 constructional details of an associated actuator having a MEMS construction, i.e. constructed using semiconductor technology such as etching MEMS per se B81B, B81C
• CPC Class Codes: G02B 6/3594 Characterised by additional functional means, e.g. means for variably attenuating or branching or means for switching differently polarized beams

Abstract

A micro relay switch (300) having a main body (13), a first electrical contact (302) positioned on a moveable relay switching element (17), and a second electrical contact positioned on the main body (13). One or more membranes (26, 52) connect the moveable switching element (17) to the main body (13) and an actuator (30) moves the moveable switching element (17) from a first position (72) to a second position (74). The first and second electrical contacts (302, 304) are positioned such that when the actuator (30) moves the moveable relay switching element (17) from the first position (72) to the second position (74), the first electrical contact (302) makes electrical connection with the second electrical contact (304). The membranes may be either or both of a primary membrane (26) or a secondary membrane (52). A primary membrane (26) may be used as a temporary membrane (32).

Claims

1. A microstructure relay switch comprising:

a main body;

a moveable relay switching element;

at least one membrane which connects said moveable relay switching element to said main body;

an actuator which moves said moveable relay switching element from a first position to a second position;

a first electrical contact being positioned on said moveable relay switching element; and

a second electrical contact being positioned on said main body, such that when said actuator moves said moveable relay switching element from said first position to said second position, said first electrical contact makes electrical connection with said second electrical contact to complete an electrical circuit.

2. A microstructure relay switch as in claim 1, wherein:

said at least one membrane is a primary membrane.

3. A microstructure relay switch as in claim 1, wherein:

said at least one membrane is a secondary membrane.

4. A microstructure relay switch as in claim 1, wherein:

said at least one membrane includes an actuator.

5. A microstructure relay switch as in claim 3, wherein:

said actuator is integrally formed with said secondary membrane.

6. A microstructure relay switch as in claim 1, wherein:

said actuator is formed independently of said at least one membrane.

7. A microstructure relay switch as in claim 1, wherein:

said moveable relay switching element is formed from a portion of said main body.

8. A microstructure relay switch as in claim 7, wherein:

said moveable relay switching element is formed from said portion of said main body by a process chosen from the group consisting of chemical etching, ion etching, laser etching and mechanical micro-machining.

9. A microstructure relay switch as in claim 1, wherein:

said actuator is a mechanism chosen from the group consisting of piezoelectric devices, screw shafts, electrostatic, electromagnetic, hydraulic and rotary type actuators.

10. A microstructure relay switch as in claim 1, further comprising:

a third electrical contact, such that when said actuator moves said moveable relay switching element from said first position to said second position, said first electrical contact makes electrical connection with said second electrical contact and said third electrical contact to complete an electrical circuit.

11. A microstructure relay switch as in claim 1, wherein:

said first electrical contact is formed integrally with said moveable relay switching element.

12. A microstructure relay switch as in claim 1, wherein:

said first electrical contact is independently formed and mounted onto said moveable relay switching element.

13. A microstructure relay switch as in claim 2, wherein:

said primary membrane is a temporary membrane which is removed after said actuator is attached.

14. A microstructure relay switch as in claim 1, wherein:

said at least one membrane also includes a secondary membrane which remains in position after said temporary membrane is removed.

15. A microstructure relay switch prepared by the process comprising the steps of:

A) providing a substrate main body;

B) forming first and second electrical contacts on said substrate main body; and

C) forming a groove surrounding a shaft, said groove not extending to completely separate said shaft from said substrate material, so that a membrane of material remains which connects said shaft to said substrate main body, said first electrical contact being positioned on said shaft, and said second electrical contact being positioned on said substrate main body.

16. A microstructure relay switch as in claim 15, wherein process step C includes:

1) forming an upper trench from the top surface of said substrate main body;

2) forming a lower trench from the bottom surface of said substrate main body; and

3) using a stop device to limit the depth of forming of said upper trench and said lower trench to leave a primary membrane.

17. A microstructure relay switch as in claim 15, wherein process step B includes:

1) etching said substrate main body to form grooves;

2) depositing a first metal contact layer to form said first electrical contact;

3) depositing a sacrificial layer over said first metal contact layer;

4) depositing a second metal contact layer overlapping portions of said sacrificial layer to form said second electrical contact; and

5) removing said sacrificial layer.

18. A microstructure relay switch as in claim 15, further comprising:

D) providing an actuator connected to said shaft, said actuator producing movement between a first position and a second position.

19. A microstructure relay switch as in claim 16, further comprising:

E) removing said primary membrane, to leave said shaft free-standing.

20. A microstructure relay switch as in claim 15, further comprising:

E) attaching a secondary membrane to said shaft.

21. A microstructure relay switch as in claim 20, further comprising:

F) removing said primary membrane, leaving said shaft attached to said secondary membrane.

22. A method for manufacturing microstructure relay switches comprising the steps of:

A) providing a substrate main body;

B) forming first and second electrical contacts on said substrate main body; and

C) forming a groove surrounding a shaft, said groove not extending to completely separate said shaft from said substrate material, so that a membrane of material remains which connects said shaft to said substrate main body, said first electrical contact being positioned on said shaft, and said second electrical contact being positioned on said substrate main body.

23. A method for manufacturing microstructure relay switches as in claim 22, wherein process step C includes:

1) forming an upper trench from the top surface of said substrate main body;

2) forming a lower trench from the bottom surface of said substrate main body; and

3) using a stop device to limit the depth of forming of said upper trench and said lower trench to leave a primary membrane.

24. A method for manufacturing microstructure relay switches as in claim 22, wherein process step B includes:

1) etching said substrate main body to form grooves;

2) depositing a first metal contact layer to form said first electrical contact;

3) depositing a sacrificial layer over said first metal contact layer;

4) depositing a second metal contact layer overlapping portions of said sacrificial layer to form said second electrical contact; and

5) removing said sacrificial layer.

25. A method for manufacturing microstructure relay switches as in claim 22, further comprising:

D) providing an actuator connected to said shaft, said actuator producing movement between a first position and a second position.

26. A method for manufacturing microstructure relay switches as in claim 25, further comprising:

E) removing said primary membrane, to leave said shaft free-standing.

27. A method for manufacturing microstructure relay switches as in claim 25, further comprising:

E) attaching a secondary membrane to said shaft.

28. A method for manufacturing microstructure relay switches as in claim 27, further comprising:

F) removing said primary membrane, leaving said shaft attached to said secondary membrane.

29. A relay switching array for relay switching signals from at least one input channel between a plurality of output channels, comprising:

a plurality of relay switches, each relay switch having a main body, a moveable relay switching element, at least one membrane which connects said moveable relay switching element to said main body, an actuator which moves said moveable relay switching element from a first position to a second position, a first electrical contact being positioned on said moveable relay switching element, and a second electrical contact being positioned on said main body, such that when said actuator moves said moveable relay switching element from said first position to said second position, said first electrical contact makes electrical connection with said second electrical contact to complete an electrical circuit

at least one input channeling device which delivers at least one input signal to said relay switch array; and

a plurality of output channeling devices which receives at least one output signal from said relay switch array.

30. A relay switching array as in claim 29, wherein:

said at least one membrane includes a primary membrane.

31. A relay switching array as in claim 29, wherein:

said at least one membrane includes a secondary membrane.