Low-temperature patterned wafer bonding with photosensitive benzocyclobutene (BCB) and 3D MEMS (microelectromechanical systems) structure fabrication
First Claim
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1. A method of low-temperature bonding an apparatus, said method comprising:
- providing a first substrate having a first surface, said first surface having a first portion of a MEMS device formed thereon;
providing a second substrate having a second surface, said second surface having a second portion of said MEMS device formed thereon;
applying photosensitive benzocyclobutene to said first surface of said first substrate in a predetermined pattern to define a bonding layer, an area of said bonding layer being less than an area of said first surface;
positioning said second substrate in contact with said bonding layer on said first substrate to create a bond between said first substrate and said second substrate at said bonding layer at a temperature between about 50°
C. and about 300°
C. to form a bonded unit, said positioning of said second substrate in contact with said first substrate further joins said first portion of said MEMS device to said second portion of said MEMS device; and
etching said bonded unit to further form said MEMS device.
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Abstract
A method of low-temperature (150-300° C.) patterned wafer bonding of complex 3D MEMS comprising providing a first pre-processed wafer having a first surface and a second pre-processed wafer having a second surface. Photosensitive benzocyclobutene (BCB) polymer is then applied to the first surface of the first wafer in a predetermined pattern to define a bonding layer. The second wafer is then bonded to the first wafer only along the bonding layer.
49 Citations
18 Claims
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1. A method of low-temperature bonding an apparatus, said method comprising:
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providing a first substrate having a first surface, said first surface having a first portion of a MEMS device formed thereon;
providing a second substrate having a second surface, said second surface having a second portion of said MEMS device formed thereon;
applying photosensitive benzocyclobutene to said first surface of said first substrate in a predetermined pattern to define a bonding layer, an area of said bonding layer being less than an area of said first surface;
positioning said second substrate in contact with said bonding layer on said first substrate to create a bond between said first substrate and said second substrate at said bonding layer at a temperature between about 50°
C. and about 300°
C. to form a bonded unit, said positioning of said second substrate in contact with said first substrate further joins said first portion of said MEMS device to said second portion of said MEMS device; and
etching said bonded unit to further form said MEMS device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of low-temperature bonding an apparatus, said method comprising:
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providing a first substrate having a first surface, said first surface having a first portion of a MEMS device formed thereon;
providing a second substrate having a second surface, said second surface having a second portion of said MEMS device formed thereon;
applying photosensitive benzocyclobutene to said first surface of said first substrate in a predetermined pattern to define a bonding layer, an area of said bonding layer being less than an area of said first surface;
positioning said second substrate in contact with said bonding layer on said first substrate to create a bond between said first substrate and said second substrate at said bonding layer at a temperature between about 150°
C. and about 300°
C. to form a bonded unit, said positioning of said second substrate in contact with said first substrate further joins said first portion of said MEMS device to said second portion of said MEMS device; and
deep reactive ion etching said bonded unit to further form said MEMS device. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18)
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Specification