Attachment of organic molecules to group III, IV or V substrates
First Claim
1. A method of covalently coupling an organic molecule to a surface of a Group III, IV, or V element or to a semiconductor comprising a Group III, IV, or V element, said method comprising:
- providing a heat resistant organic molecule derivatized with an attachment group; and
contacting the derivatized heat resistant organic molecule with a surface of said Group III, IV, or V element or semiconductor comprising a Group III, IV, or V element; and
heating the surface to a temperature of at least about 200°
C. whereby said attachment group forms a covalent bond with said surface.
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Abstract
This invention provides a new procedure for attaching molecules to semiconductor surfaces, in particular silicon. The molecules, which include, but are not limited to porphyrins and ferrocenes, have been previously shown to be attractive candidates for molecular-based information storage. The new attachment procedure is simple, can be completed in short times, requires minimal amounts of material, is compatible with diverse molecular functional groups, and in some instances affords unprecedented attachment motifs. These features greatly enhance the integration of the molecular materials into the processing steps that are needed to create hybrid molecular/semiconductor information storage devices.
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Citations
42 Claims
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1. A method of covalently coupling an organic molecule to a surface of a Group III, IV, or V element or to a semiconductor comprising a Group III, IV, or V element, said method comprising:
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providing a heat resistant organic molecule derivatized with an attachment group; and
contacting the derivatized heat resistant organic molecule with a surface of said Group III, IV, or V element or semiconductor comprising a Group III, IV, or V element; and
heating the surface to a temperature of at least about 200°
C. whereby said attachment group forms a covalent bond with said surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38)
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39. A method of fabricating an ordered molecular assembly, said method comprising:
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providing a solution comprising a heat resistant organic molecule derivatized with an attachment group;
contacting said solution with a surface comprising a Group III, IV, or V element at a plurality of discrete locations on said surface; and
heating said surface to a temperature of at least about 200°
C. whereby the attachment groups form covalent bonds with said surface at said plurality of discrete locations. - View Dependent Claims (40, 41)
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42. A kit for coupling an organic molecule to the surface of a type III, IV, or V material, said kit comprising:
a container containing a heat resistant organic molecule derivatized with an attachment group, and instructional materials teaching coupling the organic molecule to the surface by heating the surface to a temperature of a out 200°
C. or more.
Specification