High power electronic package with enhanced cooling characteristics

• US 6,943,293 B1
• Filed: 09/01/2004
• Issued: 09/13/2005
• Est. Priority Date: 09/01/2004
• Status: Active Grant

• Current Assignee: Delphi Technologies Ip Limited (BorgWarner Incorporated)
• Original Assignee: Delphi Technologies, Inc. (BorgWarner Incorporated)
• Inventors: Jeter, Michael A, Taylor, Ralph S.
• Primary Examiner(s): Reichard, Dean A.
• Assistant Examiner(s): Oliva, Carmelo
• Application Number:
  US10/931,667
• Time in Patent Office: 377 Days
• Field of Search: 174/52.1, 174/52.2, 174/52.3, 174/52.4, 361/688, 361/704, 361/707, 361/708, 361/709, 361/714, 361/715, 361/717, 257/706, 257/712, 257/713
• US Class Current: 174/548
• CPC Class Codes: H01L 23/3735 Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A power electronics module includes a heat sink and an electronic package having a first layer in direct thermal communication with the heat sink. At least one electronic component is disposed between the first layer and a second layer. A thermally conductive element is in direct thermal communication with the second layer and carries heat from a first portion of the second layer to a second portion of the second layer such that the heat is transferred from the second portion of the second layer to the heat sink through the first layer.

Claims

1. A power electronics module, comprising:

a heat sink; and

an electronic package including;

a first layer in direct thermal communication with said heat sink;

a second layer;

at least one electronic component disposed between said first layer and said second layer; and

a thermally conductive element in direct thermal communication with said second layer and configured to carry heat from a first portion of said second layer to a second portion of said second layer such that the heat is transferred from said second portion of said second layer to said heat sink through said first layer.

2. The module of claim 1, wherein said thermally conductive element is disconnected from said heat sink.

3. The module of claim 1, wherein said at least one electronic component is configured to produce the heat.

4. The module of claim 1, further comprising at least one electrical conductor disposed between said first layer and said second layer, wherein said at least one electronic component comprises a plurality of electronic components, the heat transferring from said second portion of said second layer to said first layer through at least one of said electrical conductor and said electronic components.

5. The module of claim 1, wherein said second layer includes a body formed of a material having a coefficient of thermal expansion substantially matched to a coefficient of thermal expansion of said electronic component.

6. The module of claim 5, wherein a coefficient of thermal conductivity of said thermally conductive element is greater than a coefficient of thermal conductivity of said body of said second layer.

7. The module of claim 5, wherein said second layer includes an electrical conductor electrically connected to said electronic component.

8. The module of claim 1, wherein said second layer includes a body formed of a ceramic material.

9. The module of claim 1, wherein said electronic component is silicon based.

10. The module of claim 1, further comprising a plurality of additional electronic packages, said heat sink being in direct thermal communication with each of said additional electronic packages.

11. An electronic package, comprising:

a first layer configured to radiate heat from said package;

a second layer;

at least one electronic component disposed between said first layer and said second layer; and

a thermally conductive element in direct thermal communication with said second layer and configured to carry heat from a first portion of said second layer to a second portion of said second layer such that the heat is transferred from said second portion of said second layer to said heat sink through the first layer.

12. The package of claim 11, wherein said first layer is configured to engage a heat sink.

13. The package of claim 11, wherein said at least one electronic component is configured to produce the heat.

14. The package of claim 11, further comprising at least one electrical conductor disposed between said first layer and said second layer, wherein said at least one electronic component comprises a plurality of electronic components, the heat transferring from said second portion of said second layer to said first layer through at least one of said electrical conductor and said electronic components.

15. The module of claim 11, wherein said second layer includes a body formed of a material having a coefficient of thermal expansion substantially matched to a coefficient of thermal expansion of said electronic component.

16. The module of claim 15, wherein a coefficient of thermal conductivity of said thermally conductive element is greater than a coefficient of thermal conductivity of said body of said second layer.

17. The module of claim 15, wherein said second layer includes an electrical conductor electrically connected to said electronic component.

18. The module of claim 11, wherein said second layer includes a body formed of a ceramic material.

19. The module of claim 11, wherein said electronic component is silicon based.

20. The module of claim 11, wherein said thermally conductive element is formed of metal.