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Semiconductor device having bridge-connected wiring structure

  • US 6,943,445 B2
  • Filed: 03/29/2002
  • Issued: 09/13/2005
  • Est. Priority Date: 03/30/2001
  • Status: Expired due to Term
First Claim
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1. A semiconductor device comprising:

  • at least two controllable semiconductor switches connected in a bridge form;

    at least one output terminal;

    at least two positive/negative polarity DC terminals; and

    an insulating substrate including a conductor section for mounting the semiconductor switches thereon;

    wherein the insulating substrate is configured such that at least two conductor layers having a conductor section on a surface thereof and in an inner layer thereof to bridge-connect the semiconductor switches and the DC terminals and at least two insulating layers are alternately laminated, the surface and inner-layer conductor layers interposing the insulating layer therebetween are electrically connected by a conductor passing through the insulating layer interposed between the conductor layers, and a current path is so provided as to allow a current flowing through a bridge circuit for mounting said at least two semiconductor switches on the insulating substrate to flow in opposite directions between the conductor layers interposing the insulating layer therebetween.

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