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Packaging system for power supplies

  • US 6,943,455 B1
  • Filed: 02/27/2003
  • Issued: 09/13/2005
  • Est. Priority Date: 02/27/2003
  • Status: Expired due to Fees
First Claim
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1. A package for semiconductor devices comprising:

  • a plurality of metallic posts attached to a substrate;

    at least one semiconductor die having a first and second current handling electrode;

    at least one metallic strap which couples the first current handling electrode of the semiconductor die to one of the metallic posts; and

    a controller chip on the substrate and electrically coupled to a control electrode of the semiconductor die.

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