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Multichip package test

  • US 6,943,577 B2
  • Filed: 10/01/2003
  • Issued: 09/13/2005
  • Est. Priority Date: 10/01/2002
  • Status: Expired due to Fees
First Claim
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1. A method of testing a package mounted with a plurality of semiconductor chips, comprising:

  • connecting a drive channel of a test driver to a plurality of drive pins corresponding to the plurality of semiconductor chips;

    connecting an input/output channel of a test driver to a plurality of input/output pins corresponding to the plurality of semiconductor chips; and

    setting, while one of the semiconductor chips is being tested, the drive and input/output pins of other semiconductor chips to a high impedance state.

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