Exhaust gas recirculation system using absolute micromachined pressure sense die

• US 6,945,120 B1
• Filed: 08/23/2004
• Issued: 09/20/2005
• Est. Priority Date: 07/02/2004
• Status: Active Grant

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Lane, Phillip L., Wesley, Travis D., Burkett, Michael J., Wade, Richard A., Marcus, Philip J.
• Primary Examiner(s): OEN, WILLIAM L
• Application Number:
  US10/924,622
• Time in Patent Office: 393 Days
• Field of Search: 737/06, 73715-727, 737/44, 737/46, 737/54, 737/56, 257/254, 257/417, 257/418, 257/419, 338/4, 338/5, 338/36, 338/39, 338/43, 600/585, 600/406, 600/561
• US Class Current: 73/756
• CPC Class Codes: G01L 27/005 Apparatus for calibrating pressure sensors
• CPC Class Codes: G01L 9/0092 using variations in ohmic resistance
• CPC Class Codes: G01L 9/04 of resistance-strain gauges

Abstract

An absolute pressure sensor is disclosed that includes a plurality of pressure sense die and a hermetically sealed cover located above the plurality of pressure sense die. A carrier can be provided to which the pressure sense die are mounted by a cured adhesive. The carrier and the pressure sense die can be attached to a circuit board populated with a plurality of surface mounted components for electrical connection to the absolute pressure sensor. An ASIC can also be provided for digitally calibrating the pressure sense die with temperature compensation, wherein the ASIC automatically controls a plurality of output modes thereof during calibration.

Claims

1. An absolute pressure sensing system, comprising:

an absolute pressure sensor composed of a plurality of pressure sense die and a hermetically sealed cover located above said plurality of pressure sense die;

a carrier to which said plurality of pressure sense die are mounted by a cured adhesive, wherein said carrier and said plurality of pressure sense die are attached to a circuit board populated with a plurality of surface mounted components for electrical connection to said absolute pressure sensor; and

an ASIC for digitally calibrating said plurality of pressure sense die with temperature compensation, wherein said ASIC automatically controls a plurality of output modes thereof during calibration.

2. The system of claim 1 wherein said plurality of output modes comprise at least one of the following output modes:

initial and subsequent output pressure data, initial and subsequent temperature data, differential pressure data, and flow data.

3. The system of claim 1 wherein said ASIC permits said absolute pressure sensor to convert from a MAP/MAP sensor configuration to a DP/MAP sensor configuration in-process.

4. The system of claim 1 further comprising a housing in which said absolute pressure sensor is located in association with said carrier and said circuit board populated with said plurality of surface mounted components for electrical connection to said absolute pressure sensor.

5. The system of claim 4 wherein said plurality of pressure sense die comprise two pressure sense die connected to said circuit board utilizing at least one wire bond.

6. The system of claim 5 wherein said at least one wire bond comprises a gold ball wire bond.

7. The system of claim 5 wherein said circuit board comprises a Printed Circuit Board (PCB) that includes a board assembly comprising:

an over-voltage and reverse polarity protection circuit;

an EMC protection circuit; and

an output protection circuit.

8. The system of claim 7 wherein said EMC protection circuit is associated with a steel EMI shield crimped into said PCB to protect said at least one wire bond from damage and provide EMI protection thereof.

9. The system of claim 7 further comprising a final assembly comprising a lid pressed into said housing with a cured adhesive, wherein said lid includes a vent hold sealed with a cured epoxy.

10. The system of claim 1 wherein said plurality of pressure sense die are formed from micromachined silicon with a plurality of piezoresistors in a bridge circuit in association with a topside glass cap and a plurality of wire bond pads thereof for electrical connection to said bridge circuit.

11. A sensor system, comprising:

an absolute pressure sensor comprising a plurality of pressure sense die and a hermetically sealed cover located above said plurality of pressure sense die;

a carrier to which said plurality of pressure sense die are mounted by a cured adhesive, wherein said carrier and said plurality of pressure sense die are attached to a circuit board populated with a plurality of surface mounted components for electrical connection to said absolute pressure sensor, wherein said circuit board comprises a board assembly comprising an over-voltage and reverse polarity protection circuit, an EMC protection circuit, and an output protection circuit;

a housing in which said absolute pressure sensor is located in association with said carrier and said circuit board populated with said plurality of surface mounted components for electrical connection to said absolute pressure sensor;

an ASIC for digitally calibrating said plurality of pressure sense die with temperature compensation, wherein said ASIC automatically controls a plurality of output modes thereof during calibration.

12. The system of claim 11 wherein said ASIC permits said absolute pressure sensor to convert from a MAP/MAP sensor configuration to a DP/MAP sensor configuration in-process.

13. The system of claim 11 further comprising a housing in which said absolute pressure sensor is located in association with said carrier and said circuit board populated with said plurality of surface mounted components for electrical connection to said absolute pressure sensor.

14. An absolute pressure sensing method, comprising the steps of:

providing an absolute pressure sensor comprising a plurality of pressure sense die and a hermetically sealed cover located above said plurality of pressure sense die;

mounting said plurality of pressure sense die to a carrier by a cured adhesive, wherein said carrier and said plurality of pressures sense die are attached to a circuit board populated with a plurality of surface mounted components for electrical connection to said absolute pressure sensor; and

automatically and digitally calibrating said plurality of pressure sense die with temperature compensation utilizing an ASIC that controls a plurality of output modes thereof during calibration.

15. The method of claim 14 wherein said plurality of output modes comprise at least one of the following output modes:

initial and subsequent output pressure data, initial and subsequent temperature data, differential pressure data, and flow data.

16. The method of claim 14 further comprising the step of automatically converting said absolute pressure sensor from a MAP/MAP sensor configuration to a DP/MAP sensor configuration in-process utilizing said ASIC.

17. The method of claim 14 further comprising the step of providing a housing in which said absolute pressure sensor is located in association with said carrier and said circuit board populated with said plurality of surface mounted components for electrical connection to said absolute pressure sensor.

18. The method of claim 17 further comprising the step of configuring said plurality of pressure sense die to comprise two pressure sense die connected to said circuit board utilizing at least one wire bond.

19. The method of claim 18 further comprising the step of configuring said circuit board to comprise a Printed Circuit Board (PCB) that includes a board assembly comprising:

an over-voltage and reverse polarity protection circuit;

an output protection circuit and;

an EMC protection circuit wherein said EMC protection circuit is associated with a steel EMI shield crimped into said PCB to protect said at least one wire bond from damage and provide EMI protection thereof.

20. The method of claim 19 further comprising the steps of:

forming a final assembly comprising a lid pressed into said housing with a cured adhesive, wherein said lid includes a vent hold seated with a cured epoxy.

21. The method of claim 14 further comprising the step of initially forming said plurality of pressure sense die from micromachined silicon with a plurality of piezoresistors in a bridge circuit thereof.