Integrated circuit package separators

• US 6,945,151 B1
• Filed: 10/12/2000
• Issued: 09/20/2005
• Est. Priority Date: 10/20/1998
• Status: Expired due to Fees

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Tripard, Jason E.
• Primary Examiner(s): Choi, Stephen
• Application Number:
  US09/687,600
• Time in Patent Office: 1,804 Days
• Field of Search: 834/51, 834/671, 834/685, 834/686, 83/56, 836/14, 839/291, 839/39, 839/53, 269/54.5, 269/54.1, 269/295, 269/311, 269/313, 269/314, 269/903, 269/909, 269/47, 269/50, 269/52, 269/13, 269/14
• US Class Current: 83/467.1
• CPC Class Codes: B26D 1/14 with a circular cutting member, e.g. disc cutter
• CPC Class Codes: B26D 7/01 Means for holding or positioning work
• CPC Class Codes: B26D 7/18 Means for removing cut-out material or waste
• CPC Class Codes: H01L 21/481 Insulating layers on insulating parts, with or without metallisation
• CPC Class Codes: H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections
• CPC Class Codes: H05K 2203/0165 Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
• CPC Class Codes: H05K 2203/0228 Cutting, sawing, milling or shearing
• CPC Class Codes: H05K 2203/167 Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
• CPC Class Codes: H05K 3/0052 Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
• CPC Class Codes: Y10S 83/953 with work support
• CPC Class Codes: Y10T 29/5313 Means to assemble electrical device
• CPC Class Codes: Y10T 29/53274 Means to disassemble electrical device
• CPC Class Codes: Y10T 29/53309 Disassembly means
• CPC Class Codes: Y10T 83/7593 Work-stop abutment
• CPC Class Codes: Y10T 83/7633 Collapsible

Abstract

A base having a plurality of pins extending upwardly therefrom is provided. A support is provided over the base. The support has an upper surface and a plurality of holes extending therethrough. The pins extend through the holes and upwardly beyond the upper surface of the support. An actuator is provided beneath the support. A board having a plurality of integrated circuits bonded thereto is provided. The integrated circuits form a repeating pattern of integrated circuit packages across the board, and the board has a plurality of holes extending through it. The board is placed over the support upper surface with the pins extending into the holes in the board. While the board is over the support upper surface, it is cut to separate the integrated circuit packages from one another.

Claims

1. An integrated circuit package separator for separating a plurality of integrated circuit packages from one another, the integrated circuit packages being provided as integrated circuit chip components joined to a board, the separating including cutting the board, the separator comprising:

a panel;

a plurality of blocks over the panel, the plurality of blocks having curved upper surfaces and configured to form a recessed portion over an uppermost surface of the panel, the plurality of blocks being configured to support the board while leaving the integrated circuit chip components in the recessed portion extending between the block upper surfaces and the uppermost surface of the panel, the recessed portion terminating at the uppermost surface of the panel wherein an entirety of the recessed portion is elevationally above the uppermost surface;

a base disposed below the panel and having a plurality of upwardly extending pins for retaining the board;

a pair of oppositely disposed actuators configured for lifting the board from the plurality of the pins; and

a cutting mechanism configured to cut the board while the board is supported on the plurality of blocks and to thereby separate the integrated circuit packages from one another.

2. The separator of claim 1 wherein the panel is fastened to a support.

3. The separator of claim 1 wherein the components have a thickness and the blocks have a thickness about equal to that of the components.

4. The separator of claim 1 wherein at least some of the components have a common thickness and the blocks have a thickness about equal to said common thickness.

5. The separator of claim 1 wherein the blocks are in a one-to-one correspondence with the integrated circuit packages on the board.

6. The separator of claim 1 comprising more than one panel over a support, each panel having blocks associated therewith.

7. The separator of claim 6 wherein the each of the panels and blocks associated therewith is a panel and block assembly, the panel and block assemblies all being identical to one another.

8. The separator of claim 1 wherein the blocks are fastened to the panel.

9. The separator of claim 1 wherein the blocks are one-piece with the panel.

10. The separator of claim 1 wherein the pins extend upwardly from beneath the panel to beyond an upper surface of the panel, the pins configured to extend into the board and retain the board over the panel.

11. The separator of claim 1 wherein the pins do not extend through the panel.

12. The separator of claim 1 wherein the pair of the actuators is configured to vertically displace the panel.

13. The separator of claim 1 wherein the pair of the actuators is pneumatically powered.

14. The separator of claim 13 wherein the pair of the actuators comprises a release valve configured to equilibrate a back-pressure of the actuator to ambient during lifting of a support comprising the panel.

15. The separator of claim 1 wherein the panel comprises aluminum.

16. The separator of claim 1 wherein the blocks are formed as discrete pieces from the panel.

17. The separator of claim 1 wherein the blocks are formed as discrete pieces from the panel and are fastened to the panel.

18. The separator of claim 1 wherein the blocks extend above an uppermost surface of the panel at a height from about 0.035 inches to about 0.045 inches.

19. The separator of claim 1 wherein the blocks extend above an uppermost surface of the panel at a height from about 0.135 inches to about 0.145 inches.

20. The separator of claim 1 wherein the panel is molded as part of the separator.

21. The separator of claim 1 further comprising a plate to support the panel, the plate comprising static-reduced plastic.