×

Method for attaching a porous metal layer to a metal substrate

  • US 6,945,448 B2
  • Filed: 06/06/2003
  • Issued: 09/20/2005
  • Est. Priority Date: 06/18/2002
  • Status: Active Grant
First Claim
Patent Images

1. A method for attaching a porous metal structure to a metal substrate, the method comprising:

  • providing a metal substrate comprising a metal selected from the group consisting of cobalt, cobalt alloy, titanium and titanium alloy;

    providing a binding mixture;

    providing the porous metal structure;

    applying the binding mixture to the porous structure by means selected from the group consisting of spraying, and dipping;

    placing the porous structure against the substrate such that the binding mixture is disposed between the metal component and the porous structure, thereby forming an assembly; and

    heating the assembly to metallurgically bond the porous structure and the substrate.

View all claims
  • 4 Assignments
Timeline View
Assignment View
    ×
    ×