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Process for fabricating a leadless plastic chip carrier

  • US 6,946,324 B1
  • Filed: 10/30/2003
  • Issued: 09/20/2005
  • Est. Priority Date: 06/10/1998
  • Status: Expired due to Term
First Claim
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1. A process for fabricating a leadless plastic chip carrier, comprising:

  • laminating a first metal strip to a second metal strip to form a leadframe strip;

    selectively etching said first metal strip to define at least a die attach pad and at least one row of contact pads;

    mounting a semiconductor die to said die attach pad and wire bonding said semiconductor die to ones of said contact pads;

    encapsulating a top surface of said leadframe strip in a molding material;

    removing said second metal strip, thereby exposing said die attach pad and said at least one row of contact pads; and

    singulating the leadless plastic chip carrier from the leadframe strip.

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