Method and device for protecting micro electromechanical systems structures during dicing of a wafer
First Claim
Patent Images
1. A method for protecting a MEMS structure during a dicing of a MEMS wafer to produce individual MEMS dies, comprising the steps of:
- (a) preparing a MEMS wafer having a plurality of MEMS structure sites on a first side and a plurality of through holes on a second side;
(b) mounting, upon the first side of the MEMS wafer, a wafer cap to produce a laminated MEMS wafer, the wafer cap being recessed in areas corresponding to locations of the MEMS structure sites on the MEMS wafer;
(c) mounting, upon the second side of the MEMS wafer, a layer of dicing tape; and
(d) dicing the laminated MEMS wafer into a plurality of MEMS dies.
1 Assignment
0 Petitions
Accused Products
Abstract
A wafer cap protects micro electromechanical system (“MEMS”) structures during a dicing of a MEMS wafer to produce individual MEMS dies. A MEMS wafer is prepared having a plurality of MEMS structure sites thereon. Upon the MEMS wafer, the wafer cap is mounted to produce a laminated MEMS wafer. The wafer cap is recessed in areas corresponding to locations of the MEMS structure sites on the MEMS wafer. The capped MEMS wafer can be diced into a plurality of MEMS dies without causing damage to or contaminating the MEMS die.
26 Citations
103 Claims
-
1. A method for protecting a MEMS structure during a dicing of a MEMS wafer to produce individual MEMS dies, comprising the steps of:
-
(a) preparing a MEMS wafer having a plurality of MEMS structure sites on a first side and a plurality of through holes on a second side;
(b) mounting, upon the first side of the MEMS wafer, a wafer cap to produce a laminated MEMS wafer, the wafer cap being recessed in areas corresponding to locations of the MEMS structure sites on the MEMS wafer;
(c) mounting, upon the second side of the MEMS wafer, a layer of dicing tape; and
(d) dicing the laminated MEMS wafer into a plurality of MEMS dies. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 57)
-
-
56. The method as claimed in 44, wherein a height of the perforated tape prevents electrostatically induced damage.
-
58. A method for protecting a MEMS structure during a dicing of a MEMS wafer to produce individual MEMS dies, comprising the steps of:
-
(a) fabricating a MEMS wafer having a plurality of MEMS structure sites on a first side and a plurality of through holes on a second side;
(b) fabricating a wafer cap;
(c) bonding the wafer cap to the first side of the MEMS wafer to produce a laminated MEMS wafer, the wafer cap being recessed in areas corresponding to locations of the MEMS structure sites on the MEMS wafer;
(d) mounting, upon the second side of the MEMS wafer, a layer of dicing tape; and
(e) dicing the second side of the laminated MEMS wafer into a plurality of MEMS dies. - View Dependent Claims (59, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 70, 71, 72, 73, 74, 75, 76, 77, 78, 79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89, 90, 91, 92, 93, 94, 95)
-
-
96. A method for protecting a MEMS wafer during a dicing, comprising the steps of:
-
(a) mounting, upon a backside of the MEMS wafer, a layer of dicing tape, the MEMS wafer having a plurality of MEMS structure sites on a front side and a plurality of through holes, each through hole corresponding to a MEMS structure site, the through holes being formed such that each through hole penetrates through the wafer from the backside of the wafer to the front side; and
(b) dicing the MEMS wafer into a plurality of dies such that each die includes a MEMS structure site and a corresponding through hole. - View Dependent Claims (97, 98, 99, 100, 101, 102, 103)
-
Specification