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Method and device for protecting micro electromechanical systems structures during dicing of a wafer

  • US 6,946,366 B2
  • Filed: 12/05/2001
  • Issued: 09/20/2005
  • Est. Priority Date: 12/05/2000
  • Status: Active Grant
First Claim
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1. A method for protecting a MEMS structure during a dicing of a MEMS wafer to produce individual MEMS dies, comprising the steps of:

  • (a) preparing a MEMS wafer having a plurality of MEMS structure sites on a first side and a plurality of through holes on a second side;

    (b) mounting, upon the first side of the MEMS wafer, a wafer cap to produce a laminated MEMS wafer, the wafer cap being recessed in areas corresponding to locations of the MEMS structure sites on the MEMS wafer;

    (c) mounting, upon the second side of the MEMS wafer, a layer of dicing tape; and

    (d) dicing the laminated MEMS wafer into a plurality of MEMS dies.

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