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System and methods for hermetic sealing of post media-filled MEMS package

  • US 6,946,728 B2
  • Filed: 02/19/2004
  • Issued: 09/20/2005
  • Est. Priority Date: 02/19/2004
  • Status: Active Grant
First Claim
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1. A micro-electro-mechanical system (MEMS) package for hermetically sealing a MEMS device, comprising:

  • the MEMS package having a fill port, wherein the fill port is a through hole capable of having at least one medium inserted through the fill port;

    at least one low temperature curing sealant placed within the fill port wherein the at least one low temperature curing sealant substantially fills the fill port; and

    a metal cap placed over the at least one low temperature curing sealant in a specific pattern wherein the metal cap substantially hermetically seals the fill port.

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