Packaging plate for magnetic circuit, method for packaging magnetic circuit using the same, and magnetic circuit package

• US 6,946,939 B2
• Filed: 09/10/2004
• Issued: 09/20/2005
• Est. Priority Date: 09/10/2003
• Status: Expired due to Fees

• Current Assignee: Shin-Etsu Chemical Company Limited
• Original Assignee: Shin-Etsu Chemical Company Limited
• Inventors: Doi, Yuhito
• Primary Examiner(s): Barrera, Ramon M.
• Application Number:
  US10/937,980
• Publication Number:
  US 20050052266A1
• Time in Patent Office: 375 Days
• Field of Search: 335296-306, 174 32- 35 TS, 324318-320
• US Class Current: 335/296
• CPC Class Codes: G01R 33/383 using permanent magnets
• CPC Class Codes: H01F 7/0205 Magnetic circuits with PM in general

Abstract

It is an object to provide a package for a magnetic circuit, with which a leakage magnetic field escaping from an aperture of a magnetic circuit is reduced and the magnetic attraction acting on the packaging plates is lowered, thus reducing the number of packaging work steps. There are provided a packaging plate for a permanent magnet-type magnetic circuit, the packaging plate comprising at least one non-magnetic layer and at least one magnetic layer; and a method for packaging a permanent magnet-type magnetic circuit, comprising a step of shielding at least a portion of an aperture of a permanent magnet-type magnetic circuit using at least one packaging plates.

Claims

1. A packaging plate for a permanent magnet-type magnetic circuit, the packaging plate comprising at least one non-magnetic layer and at least one magnetic layer;

wherein the total thickness of the non-magnetic layer is 5 mm or more and the total thickness of the magnetic layer is 1 mm or less; and

wherein the packaging plate has a three-layer structure of non-magnetic/magnetic/non-magnetic layers.

2. A method for packaging a permanent magnet-type magnetic circuit, comprising a step of shielding at least a portion of an aperture of a permanent magnet-type magnetic circuit using at least one packaging plate for a permanent magnet-type magnetic circuit, the packaging plate comprising at least one non-magnetic layer and at least one magnetic layer;

wherein the permanent magnet-type magnetic circuit comprises;

pair of permanent magnets opposing each other across a gap, the pair of permanent magnets being magnetized in a thickness direction;

a yoke arranged outside of the gap between the permanent magnets, the yoke supporting the permanent magnets; and

a pair of pole pieces each arranged on a gap side of an opposing surface of each of the permanent magnets and having a peripheral projection in opposing directions;

wherein the permanent magnet-type magnetic circuit can generate a magnetic field between the pole pieces.

3. The method according to claim 2, wherein the total thickness of the non-magnetic layer is 5 mm or more and the total thickness of the magnetic layer is 1 mm or less.

4. The method according to claim 2, wherein the packaging plate has a three-layer structure of non-magnetic/magnetic/non-magnetic layers.

5. A permanent magnet-type magnetic circuit package comprising:

a permanent magnet-type magnetic circuit comprising;

a pair of permanent magnets opposing each other across a gap, the pair of permanent magnets being magnetized in thickness direction;

a yoke arranged outside of the gap between the permanent magnets, the yoke supporting the permanent magnets; and

a pair of pole pieces each arranged on a gap aide of an opposing surface of each of the permanent magnets and having a peripheral projection in opposing direction;

wherein the permanent magnet-type magnetic circuit can generate a magnetic field between the pole pieces; and

at least one packaging plate comprising at least one non-magnetic layer and at least one magnetic layer, said packaging plate fixed to the magnetic circuit so as to shield at least a portion of an aperture of the magnetic circuit.

6. The package according to claim 5, wherein the total thickness of the non-magnetic layer is 5 mm or more and the total thickness of the magnetic layer is 1 mm or less.

7. The package according to claim 5, wherein the packaging plate has a three-layer structure of non-magnetic/magnetic/non-magnetic layers.