Electronic component and method of manufacturing the same
First Claim
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1. An electronic component comprising:
- a base;
a film provided to said base;
a groove formed on both of said base and said film;
a resin section provided in a recess formed on a bottom of said groove;
a protective member for covering said groove and being bonded to said resin section; and
a terminal section provided to both ends of said base and sandwiching said protective member.
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Accused Products
Abstract
In an electronic component, an element section is formed on a base, and the element section has functions of at least one of inductance, resistor, and capacitor. Resist film is formed on at least the lateral faces of the base. An unnecessary part of patterned resist film is removed, and a protective member is formed on that removed place. Then remaining resist film is removed. This manufacturing method can provide the electronic component excellent in bonding strength between the protective member and the base.
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Citations
17 Claims
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1. An electronic component comprising:
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a base;
a film provided to said base;
a groove formed on both of said base and said film;
a resin section provided in a recess formed on a bottom of said groove;
a protective member for covering said groove and being bonded to said resin section; and
a terminal section provided to both ends of said base and sandwiching said protective member. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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Specification