Low cost antennas and electromagnetic (EMF) absorption in electronic circuit packages or transceivers using conductive loaded resin-based materials
First Claim
1. A case or shell for electronic devices, comprising:
- a bottom element, a sidewall element, and a top element, wherein part or all of said bottom, part or all of said sidewall element, and part or all of said top are formed of a conductive loaded resin-based material, and wherein said conductive loaded resin-based material comprises conductor fibers, conductor powders, or a combination of said conductor fibers and said conductor powders in a base resin host and the ratio of the weight of said conductor fibers, said conductive powders, or said combination of conductive fibers and conductive powders to the weight of said base resin host is between about 0.20 and 0.40;
an antenna element formed in said sidewall element wherein said antenna element is formed of said conductive loaded resin-based material;
a system having interconnected electronic devices placed within said top element, said sidewall element, and said bottom element; and
electrical connections from said antenna element to said system having interconnected electronic devices.
1 Assignment
0 Petitions
Accused Products
Abstract
Low cost antennas and electromagnetic absorbing parts formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises conductive fibers, conductive powders, or in combination thereof in a resin base host wherein the ratio of the weight of the conductor fibers, conductor powders, or combination of conductor fibers and conductor powders to the weight of the base resin host is between about 0.20 and 0.40. The conductive fibers or conductive powders can be stainless steel, nickel, copper, silver, carbon, graphite, plated fibers or particles, or the like. The antenna elements can be formed using methods such as injection molding or extrusion. Virtually any antenna, ground planes, or shielding packages fabricated by conventional means of metal can be fabricated using the conductive loaded resin-based materials. The conductive loaded resin-based material used to form the antenna elements, EMF absorbing elements, or ground planes can be in the form of a thin flexible material, which can be readily cut to the desired shape.
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Citations
40 Claims
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1. A case or shell for electronic devices, comprising:
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a bottom element, a sidewall element, and a top element, wherein part or all of said bottom, part or all of said sidewall element, and part or all of said top are formed of a conductive loaded resin-based material, and wherein said conductive loaded resin-based material comprises conductor fibers, conductor powders, or a combination of said conductor fibers and said conductor powders in a base resin host and the ratio of the weight of said conductor fibers, said conductive powders, or said combination of conductive fibers and conductive powders to the weight of said base resin host is between about 0.20 and 0.40;
an antenna element formed in said sidewall element wherein said antenna element is formed of said conductive loaded resin-based material;
a system having interconnected electronic devices placed within said top element, said sidewall element, and said bottom element; and
electrical connections from said antenna element to said system having interconnected electronic devices. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. An electronic circuit package, comprising:
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a first package element formed of a conductive loaded resin-based material wherein said conductive loaded resin-based material comprises conductor fibers, conductor powders, or a combination of said conductor fibers and said conductor powders in a base resin host and the ratio of the weight of said conductor fibers, said conductive powders, or said combination of conductive fibers and conductive powders to the weight of said base resin host is between about 0.20 and 0.40;
a substrate formed in said first package element wherein said substrate is an insulator;
integrated circuit elements attached to said substrate;
a second package element formed of said conductive loaded resin-based material, wherein said second package element is attached to said first package element covering said substrate and said integrated circuit elements so that said first package element and said second package element form a protective shell and an electromagnetic absorber around said substrate and said integrated circuit elements;
conducting electrodes between said substrate and the exterior of said protective shell;
insulation between said conducting electrodes and said first package element; and
insulation between said conducting electrodes and said second package element. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19)
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20. A method of forming a case or shell for electronic devices, comprising:
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forming a bottom element, a sidewall element, and a top element, wherein part or all of said bottom, part or all of said sidewall element, and part or all of said top are formed of a conductive loaded resin-based material, and wherein said conductive loaded resin-based material comprises conductor fibers, conductor powders, or a combination of said conductor fibers and said conductor powders in a base resin host and the ratio of the weight of said conductor fibers, said conductive powders, or said combination of conductive fibers and conductive powders to the weight of said base resin host is between about 0.20 and 0.40;
forming an antenna element in said sidewall element wherein said antenna element is formed of said conductive loaded resin-based material;
placing a system having interconnected electronic devices within said top element, said sidewall element, and said bottom element; and
forming electrical connections from said antenna element to said system having interconnected electronic devices. - View Dependent Claims (21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31)
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32. A method of forming an electronic circuit package, comprising:
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forming a first package element of a conductive loaded resin-based material wherein said conductive loaded resin-based material comprises conductor fibers, conductor powders, or a combination of said conductor fibers and said conductor powders in a base resin host and the ratio of the weight of said conductor fibers, said conductive powders, or said combination of conductive fibers and conductive powders to the weight of said base resin host is between about 0.20 and 0.40;
placing a substrate in said first package element wherein said substrate is an insulator;
attaching integrated circuit elements to said substrate;
forming a second package element of said conductive loaded resin-based material, wherein said second package element is attached to said first package element covering said substrate and said integrated circuit elements so that said first package element and said second package element form a protective shell and an electromagnetic shield around said substrate and said integrated circuit elements;
attaching conducting electrodes between said substrate and the exterior of said protective shell;
placing insulation between said conducting electrodes and said first package element; and
placing insulation between said conducting electrodes and said second package element. - View Dependent Claims (33, 34, 35, 36, 37, 38, 39, 40)
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Specification