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Ball grid array package with an electromagnetic shield connected directly to a printed circuit board

  • US 6,947,295 B2
  • Filed: 01/20/2004
  • Issued: 09/20/2005
  • Est. Priority Date: 01/20/2003
  • Status: Expired due to Fees
First Claim
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1. A ball grid array package comprising:

  • a chip including a substrate with a bottom surface;

    a plurality of solder bumps projecting outwardly from said bottom surface of said substrate; and

    an electromagnetic shield including a housing that defines an inner space which receives said chip and said solder bumps therein, and a bottom opening for access into said inner space;

    wherein said solder bumps project outwardly of said inner space through said bottom opening in said housing;

    wherein said housing of said electromagnetic shield has a peripheral wall that surrounds said chip and said solder bumps; and

    wherein said peripheral wall is formed with at least one side opening, said substrate having a corresponding tab projecting outwardly therefrom and extending transversely of said peripheral wall through said side opening.

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