Ball grid array package with an electromagnetic shield connected directly to a printed circuit board
First Claim
Patent Images
1. A ball grid array package comprising:
- a chip including a substrate with a bottom surface;
a plurality of solder bumps projecting outwardly from said bottom surface of said substrate; and
an electromagnetic shield including a housing that defines an inner space which receives said chip and said solder bumps therein, and a bottom opening for access into said inner space;
wherein said solder bumps project outwardly of said inner space through said bottom opening in said housing;
wherein said housing of said electromagnetic shield has a peripheral wall that surrounds said chip and said solder bumps; and
wherein said peripheral wall is formed with at least one side opening, said substrate having a corresponding tab projecting outwardly therefrom and extending transversely of said peripheral wall through said side opening.
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Abstract
A ball grid array package includes a chip having a substrate with a bottom surface, a plurality of solder bumps projecting outwardly from the bottom surface of the substrate, and an electromagnetic shield including a housing that defines an inner space which receives the chip and the solder bumps therein, and a bottom opening for access into the inner space. The solder bumps project outwardly of the inner space through the bottom opening in the housing.
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Citations
7 Claims
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1. A ball grid array package comprising:
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a chip including a substrate with a bottom surface;
a plurality of solder bumps projecting outwardly from said bottom surface of said substrate; and
an electromagnetic shield including a housing that defines an inner space which receives said chip and said solder bumps therein, and a bottom opening for access into said inner space;
wherein said solder bumps project outwardly of said inner space through said bottom opening in said housing;
wherein said housing of said electromagnetic shield has a peripheral wall that surrounds said chip and said solder bumps; and
wherein said peripheral wall is formed with at least one side opening, said substrate having a corresponding tab projecting outwardly therefrom and extending transversely of said peripheral wall through said side opening. - View Dependent Claims (2, 3, 4, 5)
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6. An electronic device comprising:
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a printed circuit board;
a chip including a substrate with opposite top and bottom surfaces, and a semiconductor die mounted on said top surface of said substrate;
a plurality of solder bumps projecting outwardly from said bottom surface of said substrate and connected directly and electrically to said printed circuit board; and
an electromagnetic shield including a housing that defines an inner space which receives said chip and said solder bumps therein, and a bottom opening for access into said inner space, said housing having a bottom end that defines said bottom opening and that is connected directly to said printed circuit board;
wherein said solder bumps project outwardly of said inner space through said bottom opening in said housing;
wherein said housing of said electromagnetic shield has a peripheral wall that surrounds said chip and said solder bumps; and
wherein said peripheral wall is formed with at least one side opening, said substrate having corresponding tab projecting outwardly therefrom and extending transversely of said peripheral wall through said side opening. - View Dependent Claims (7)
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Specification