Vapor-assisted cryogenic cleaning
First Claim
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1. A method for removing at least one contaminant from a surface, comprising:
- applying at least one reactant to the surface, the at least one reactant selected from a group consisting of ozone, hydrogen, nitrogen, nitrogen oxides, nitrogen triflouride, helium, argon, neon, sulfur trioxide, oxygen, fluorine, fluorocarbon gases, ethanol, acetone, ethanol-acetone mixtures, isopropyl alcohol, methanol, methyl formate, methyl iodide, and ethyl bromide, the at least one reactant in a form selected from a group consisting of a gas and a vapor, the at least one reactant sufficient for reacting with the at least one contaminant on the surface, wherein the at least one contaminant is other than a metal contaminant;
allowing the at least one reactant to condense on the surface; and
applying cryogenic material to the surface.
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Abstract
The present invention is directed towards the use of a reactive gas or vapor of a reactive liquid prior to or in combination with cryogenic cleaning to remove contaminants from the semiconductor surfaces or other substrate surfaces requiring precision cleaning. The reactive gas or vapor is selected according to the contaminants to be removed and the reactivity of the gas or vapor with the contaminants. Preferably, this reaction forms a gaseous byproduct which is removed from the substrate surface by the flow of nitrogen across the surface.
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Citations
22 Claims
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1. A method for removing at least one contaminant from a surface, comprising:
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applying at least one reactant to the surface, the at least one reactant selected from a group consisting of ozone, hydrogen, nitrogen, nitrogen oxides, nitrogen triflouride, helium, argon, neon, sulfur trioxide, oxygen, fluorine, fluorocarbon gases, ethanol, acetone, ethanol-acetone mixtures, isopropyl alcohol, methanol, methyl formate, methyl iodide, and ethyl bromide, the at least one reactant in a form selected from a group consisting of a gas and a vapor, the at least one reactant sufficient for reacting with the at least one contaminant on the surface, wherein the at least one contaminant is other than a metal contaminant;
allowing the at least one reactant to condense on the surface; and
applying cryogenic material to the surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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Specification