Method for high kinetic energy plasma barrier deposition
First Claim
1. A method of depositing a barrier layer to improve barrier layer thickness uniformity in an interconnect opening, comprising the steps of:
- providing a substrate comprising a dielectric layer;
forming a structure comprising an interconnect opening in said dielectric layer;
initially forming a barrier layer to line said interconnect opening; and
,re-distributing said barrier layer according to a sputter-redistribution process to increase said barrier layer thickness and thickness uniformity along said interconnect opening sidewalls.
1 Assignment
0 Petitions
Accused Products
Abstract
A novel method for depositing a barrier layer on a single damascene, dual damascene or other contact opening structure. The method eliminates the need for pre-cleaning argon ion bombardment of the structure, thereby reducing or eliminating damage to the surface of the underlying conductive layer and sputtering of copper particles to the via or other contact opening sidewall. The process includes fabrication of a single damascene, dual damascene or other contact opening structure on a substrate; optionally pre-cleaning the structure typically using nitrogen or hydrogen plasma; depositing a thin metal barrier layer on the sidewalls and bottom of the structure; and redistributing or re-sputtering the barrier layer on the bottom and sidewalls of the structure.
16 Citations
20 Claims
-
1. A method of depositing a barrier layer to improve barrier layer thickness uniformity in an interconnect opening, comprising the steps of:
-
providing a substrate comprising a dielectric layer; forming a structure comprising an interconnect opening in said dielectric layer; initially forming a barrier layer to line said interconnect opening; and
,re-distributing said barrier layer according to a sputter-redistribution process to increase said barrier layer thickness and thickness uniformity along said interconnect opening sidewalls. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
-
-
13. A method of forming a barrier layer to improve barrier layer thickness uniformity comprising the steps of:
-
providing a substrate comprising a dielectric layer overlying a conductive layer; forming a structure comprising an interconnect opening in said dielectric layer to expose said conductive layer at a bottom portion of said interconnect opening; forming a barrier layer to line said interconnect opening, said barrier layer comprising a non-uniform thickness along sidewall portions; and
,re-distributing said barrier layer according to a sputter-redistribution process to increase said barrier layer thickness and thickness uniformity along said interconnect opening sidewalls. - View Dependent Claims (14, 15, 16)
-
-
17. A method of depositing a barrier layer to improve metal seed layer formation comprising the steps of:
-
providing a substrate comprising a dielectric layer overlying a conductive layer; forming a structure comprising an interconnect opening in said dielectric layer to expose said conductive layer at a bottom portion of said interconnect opening; forming a barrier layer to line said interconnect opening, said barrier layer comprising a non-uniform thickness along sidewall portions; re-distributing said barrier layer according to a sputter-redistribution process to increase said barrier layer thickness and thickness uniformity along said interconnect opening sidewalls while leaving a portion of said barrier layer covering said bottom portion; and
,then forming a metal seed layer on said barrier layer. - View Dependent Claims (18, 19, 20)
-
Specification