Semiconductor component having first surface area for electrically coupling to a semiconductor chip and second surface area for electrically coupling to a substrate, and method of manufacturing same
First Claim
1. A semiconductor component for electrical coupling to a substrate, the semiconductor component comprising:
- a semiconductor chip;
a non-leaded leadframe comprising a plurality of electrical contacts located around a periphery of the semiconductor chip;
a first electrical conductor electrically coupling together the semiconductor chip and the non-leaded leadframe; and
a mold compound disposed around the semiconductor chip, the first electrical conductor, and the plurality of electrical contacts, wherein;
at least one electrical contact of the plurality of electrical contacts comprises;
a first surface having a first surface area for electrically coupling to the semiconductor chip;
a second surface opposite the first surface and having a second surface area for electrically coupling to the substrate; and
a side surface coupling together the first surface and the second surface;
the side surface has a first concave section and a second concave section adjacent to the first concave section; and
the second surface area is larger than the first surface area.
22 Assignments
0 Petitions
Accused Products
Abstract
A semiconductor component for electrical coupling to a substrate (230) includes: a semiconductor chip (110); a non-leaded leadframe (120) including a plurality of electrical contacts (130) located around a periphery (111) of the semiconductor chip; a first electrical conductor (140) electrically coupling together the semiconductor chip and the non-leaded leadframe; and a mold compound (210) disposed around the semiconductor chip, the first electrical conductor, and the plurality of electrical contacts. At least one electrical contact of the plurality of electrical contacts includes: a first surface (310) having a first surface area for electrically coupling to the semiconductor chip; and a second surface (320) opposite the first surface and having a second surface area for electrically coupling to the substrate, where the second surface area is larger than the first surface area.
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Citations
27 Claims
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1. A semiconductor component for electrical coupling to a substrate, the semiconductor component comprising:
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a semiconductor chip;
a non-leaded leadframe comprising a plurality of electrical contacts located around a periphery of the semiconductor chip;
a first electrical conductor electrically coupling together the semiconductor chip and the non-leaded leadframe; and
a mold compound disposed around the semiconductor chip, the first electrical conductor, and the plurality of electrical contacts, wherein;
at least one electrical contact of the plurality of electrical contacts comprises;
a first surface having a first surface area for electrically coupling to the semiconductor chip;
a second surface opposite the first surface and having a second surface area for electrically coupling to the substrate; and
a side surface coupling together the first surface and the second surface;
the side surface has a first concave section and a second concave section adjacent to the first concave section; and
the second surface area is larger than the first surface area. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A semiconductor component for electrical coupling to a substrate, the semiconductor component comprising:
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a semiconductor chip;
a non-leaded leadframe comprising a plurality of electrical contacts located around a periphery of the semiconductor chip; and
a mold compound disposed around the semiconductor chip and the plurality of electrical contacts;
wherein;
each electrical contact in the plurality of electrical contacts comprises;
a first surface having a first surface area for electrical coupling to the semiconductor chip;
a second surface opposite the first surface and having a second surface area for electrical coupling to the substrate; and
a side surface coupling together the first surface and the second surface;
the second surface area is larger than the first surface area;
each electrical contact of the plurality of electrical contacts comprises a trapezoidal cross-sectional shape;
each side surface comprises at least one mold lock feature; and
the at least one mold lock feature comprises;
a first mold lock feature comprising a first concave section in the side surface; and
a second mold lock feature comprising a second concave section in the side surface and adjacent to the first concave section. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
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27. A method of manufacturing a semiconductor component for electrical coupling to a substrate, the method comprising:
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providing a non-leaded leadframe comprising;
a plurality of electrical contacts;
wherein;
each one of the plurality of electrical contacts comprises;
a first surface having a first surface area;
a second surface opposite the first surface and having a second surface area; and
a side surface coupling together the first surface and the second surface;
the side surface has a first concave section and a second concave section adjacent to the first concave section; and
the second surface area is larger than the first surface area;
mounting a semiconductor chip adjacent to the non-leaded leadframe;
coupling a first electrical conductor between the first surface of a first one of the plurality of electrical contacts and the semiconductor chip;
disposing a mold compound around the semiconductor chip, the first electrical conductor, and the plurality of electrical contacts; and
coupling a second electrical conductor between the second surface of the first one of the plurality of electrical contacts and the substrate.
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Specification