Correlation of electrical test data with physical defect data
First Claim
1. A computer-implemented method for analyzing defect data produced in testing a semiconductor chip from a logic design, comprising:
- inputting a first data set that identifies a first set of physical locations associated with defects detected during fabrication of the chip;
inputting a second test data set that includes one or more identifiers associated with failing circuitry in the chip;
determining a second set of physical locations from the one or more identifiers of failing circuitry, hierarchical relationships between blocks of the logic design, and placement information associated with the blocks, wherein each of the one or more identifiers is associated with at least one of the blocks; and
identifying correspondences between physical locations in the first data set and the second set of physical locations.
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Accused Products
Abstract
Method and apparatus are disclosed for analyzing defect data produced in testing a semiconductor chip from a logic design. In various embodiments, input for processing is a first inspection data set that identifies a first set of physical locations that are associated with defects detected during fabrication of the chip. Also input is a second test data set that includes one or more identifiers associated with failing circuitry in the chip. A second set of physical locations is determined from the one or more identifiers of failing circuitry, hierarchical relationships between blocks of the design, and placement information associated with the blocks. Each of the one or more identifiers is associated with at least one of the blocks. Correspondences are identified between physical locations in the first inspection data set and the second set of physical locations.
401 Citations
16 Claims
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1. A computer-implemented method for analyzing defect data produced in testing a semiconductor chip from a logic design, comprising:
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inputting a first data set that identifies a first set of physical locations associated with defects detected during fabrication of the chip; inputting a second test data set that includes one or more identifiers associated with failing circuitry in the chip; determining a second set of physical locations from the one or more identifiers of failing circuitry, hierarchical relationships between blocks of the logic design, and placement information associated with the blocks, wherein each of the one or more identifiers is associated with at least one of the blocks; and identifying correspondences between physical locations in the first data set and the second set of physical locations. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method for testing a semiconductor chip, comprising:
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inspecting the semiconductor chip for defects and storing an inspection data set that identifies a first set of physical locations associated with defects detected during inspection; testing circuit paths on the semiconductor chip, and storing a test data set that includes one or more identifiers associated with failing circuitry in the semiconductor chip; determining a second set of physical locations of defects described by the test data set from the one or more identifiers of failing circuitry, hierarchical relationships between blocks of a design, and placement information associated with the blocks, wherein each of the one or more identifiers is associated with at least one of the blocks; and identifying correspondences between physical locations in the inspection data set and the second set of physical locations. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15)
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16. An apparatus for analyzing defect data produced in testing a chip from a design, comprising:
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means for inputting a first data set that identifies a first set of physical locations associated with defects detected during fabrication of the chip; means for inputting a second test data set that includes one or more identifiers associated with failing circuitry in the chip; means for determining a second set of physical locations from the one or more identifiers of failing circuitry, hierarchical relationships between blocks of the design, and placement information associated with the blocks, wherein each of the one or more identifiers is associated with at least one of the blocks; and means for identifying correspondences between physical locations in the first data set and the second set of physical locations.
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Specification