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Brush scrubbing-high frequency resonating wafer processing system and methods for making and implementing the same

  • US 6,951,042 B1
  • Filed: 02/28/2003
  • Issued: 10/04/2005
  • Est. Priority Date: 02/28/2003
  • Status: Expired due to Fees
First Claim
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1. A substrate cleaning apparatus, comprising:

  • a transducer capable of resonating at a high frequency; and

    a brush material attached to a surface of the transducer, the brush material including at least one passage extending to the surface of the transducer, the brush material being configured to be applied to a surface of the substrate, the transducer when resonating at the high frequency being capable of imparting acoustic energy to the surface of the substrate at a location of the at least one passage.

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