Three-axis sensor assembly for use in an elastomeric material

• US 6,951,143 B1
• Filed: 11/28/2000
• Issued: 10/04/2005
• Est. Priority Date: 11/28/2000
• Status: Expired due to Term

• Current Assignee: Michelin Recherche et Technique SA (Compagnie Generale DES Etablissements Michelin SCA)
• Original Assignee: Michelin Recherche et Technique SA (Compagnie Generale DES Etablissements Michelin SCA)
• Inventors: Adderton, Dennis M., Minne, Stephen C.
• Primary Examiner(s): NOORI, MAX H
• Application Number:
  US09/724,655
• Time in Patent Office: 1,771 Days
• Field of Search: 738/620.44, 738/620.41, 738/620.43, 738/620.45, 738/623.38, 738/624.24, 738/626.27, 7386241-86245
• US Class Current: 73/862.044
• CPC Class Codes: B60C 11/00 Tyre tread bands; Tread patterns; Anti-skid inserts
• CPC Class Codes: B60C 2019/004 Tyre sensors other than for detecting tyre pressure
• CPC Class Codes: G01L 5/162 of piezoresistors
• CPC Class Codes: G01L 5/1627 of strain gauges using piezoresistors G01L5/162

Abstract

According to a first aspect of the preferred embodiment, a three-axis sensor assembly for use in an elastomeric material includes a first pair of sensors disposed along a first pair of respective axes that intersect, the first sensors being adapted to detect a force in a first direction. In addition, the sensor assembly includes a second pair of sensors disposed along a second pair of respective axes that intersect, the second sensors detecting a force in a second direction generally orthogonal to the first direction. Furthermore, in the assembly, the force measured in the first direction is equal to the difference between the outputs of the first sensors, and the force measured in the second direction is equal to the difference between the outputs of said second sensors. According to another aspect of the preferred embodiment, the sum of the outputs of the first sensors and the second sensors equals a force in a third direction orthogonal to the first and second directions. In another aspect of the preferred embodiment, the first pair of sensors are disposed on first opposed faces of a pyramid-shaped body, and the second pair of sensors are disposed on second opposed faces of the pyramid-shaped body. In addition, the elastomeric material can be a vehicle tire, and the tire may include a plurality of the sensor assemblies disposed about its perimeter in mutually spaced relationship.

Claims

1. A sensor assembly embedded in an elastomeric material, said sensor assembly comprising:

a pair of first strain sensors disposed on first opposed faces of a flexible pyramid-shaped body, said first strain sensors being deformable under a force applied by contact thereto for detecting a force in a first direction; and

a portion of elastomeric material in which said pair of first strain sensors and the flexible pyramid-shaped body on which said pair of first strain sensors is disposed are embedded;

wherein said first strain sensors generate corresponding output signals in response to the force in the first direction and wherein the force in the first direction is generally equal to the difference between the output signals of said first strain sensors.

2. The sensor assembly of claim 1, further comprising:

a pair of second strain sensors disposed on second opposed faces of said body, said second opposed faces adjacent to said first opposed faces, and said second strain sensors detecting a force in a second direction generally orthogonal to said first direction;

and wherein said second strain sensors generate corresponding output signals in response to the force in the second direction, and wherein the force in the second direction is generally equal to the difference between the output signals of said second strain sensors.

3. The sensor assembly of claim 2, wherein a sum of the first output signals and the second output signals is indicative of a force in a third direction is orthogonal to the first and second directions.

4. The sensor assembly of claim 1, wherein said body is made of the same material as the elastomeric material.

5. The sensor assembly of claim 1, wherein said body has a body hardness greater than the hardness of the elastomeric material.

6. The sensor assembly of claim 5, wherein the hardness of the elastomeric material is generally between 50 and 70 on the Shore A hardness scale.

7. The sensor assembly of claim 6, wherein said body is made of one of polyamide, urethane and epoxy.

8. The sensor assembly of claim 1, wherein said first strain sensors are parallel plate capacitors.

9. The sensor assembly of claim 1, wherein said first strain sensors are piezoresistive silicon strain gauges.

10. The sensor assembly of claim 1, wherein said first strain sensors are piezoelectric devices.

11. The sensor assembly of claim 10, wherein at least one of said piezoelectric devices is one of PZT, ZnO, and PVDF.

12. The sensor assembly of claim 1, wherein said first strain sensors are interdigitated finger capacitors.

13. The sensor assembly of claim 3, further including a plurality of sensor assemblies embedded in an object in a mutually spaced relationship.

14. The sensor assembly of claim 1, wherein said portion of elastomeric material comprises a tire.

15. A process of embedding a sensor in an elastomeric material, the process comprising:

providing a three-axis sensor assembly including two pairs of strain gauges, a first pair disposed on first opposed faces of a pyramid-shaped body so as to detect strain applied directly to said first pair of sensors in a first direction, and a second pair disposed on second opposed faces of the pyramid-shaped body so as to detect strain applied directly to said second pair of sensors in a second direction; and

adjusting the aspect ratio of the pyramid-shaped body to a sensitivity of the three-axis sensor.

16. The process of claim 15, further including the step of adjusting the hardness of the pyramid-shaped body relative to the elastomeric material.

17. The process of claim 15, wherein the sensor is introduced to the elastomeric material when the elastomeric material is in an uncured state.

18. The process of claim 15, further including the step of encapsulating the first and second pairs of strain gauges in a second material different than the elastomeric material.

19. The process of claim 18, further including the step of selecting a ratio of elastic moduluses between the elastomeric material and the second material.

20. The process of claim 19, wherein the second material is one of polyimide and epoxy.

21. The process of claim 20, further including the step of coupling the strain gauges to the body with an adhesive.

22. The process of claim 21, further including the step of potting the sensor assembly in a third material.

23. The process of claim 22, wherein the adhesive and the third material are the same.

24. The process of claim 15, further including the step of placing a topping layer on the sensor assembly so as to scale strain forces sensed by the strain gauges.

25. A process of embedding a sensor in an elastomeric material, the process comprising:

providing a three-axis sensor assembly including first and second pairs of strain sensors, the first pair disposed on first opposed faces of a pyramid-shaped body so as to detect strain in a first direction applied directly to the first pair of sensors, and the second pair disposed on second opposed faces of the pyramid-shaped body so as to detect strain in a second direction applied directly to the second pair of sensors; and

placing the sensor assembly in the elastomeric material when the elastomeric material is in an uncured state.

26. The process of claim 25, further comprising the step of adjusting the aspect ratio of the pyramid-shaped body according to a sensitivity of the sensor assembly..

27. The process of claim 25, further comprising the step of encapsulating the first and second pairs of strain sensors.

28. The process of claim 27, wherein said encapsulating step includes using a second material different than the elastomeric material.

29. The process of claim 28, further comprising the step of selecting a ratio of elastic moduluses between the elastomeric material and the second material.

30. The process of claim 29, wherein the second material is one of polyimide and epoxy.

31. The process of claim 28, further including the step of coupling the strain sensors to the pyramid-shaped body with an adhesive.

32. The process of claim 31, further including the step of potting the sensor assembly in a third material.

33. The process of claim 32, wherein the elastomeric material, the second material, the third material and the adhesive are different.

34. The process of claim 32, further including the step of placing a topping layer on the sensor assembly so as to scale strain forces sensed by the strain sensors.

35. The process of claim 25, further comprising the step of adjusting the hardness of the pyramid-shaped body relative to the elastomeric material.

36. The process of claim 25, further comprising the step of coupling the pyramid-shaped body to a printed circuit.

37. The process of claim 36, wherein the printed circuit board is flexible.

38. The process of claim 36, wherein the printed circuit includes a substrate and said coupling step includes coupling the pyramid-shaped body to the substrate.

39. The process of claim 38, wherein the substrate comprises a silicon IC.

40. The process of claim 39, wherein the substrate further comprises one of a polyimide and an epoxy.

41. The process of claim 40, further comprising the step of electrically coupling the strain sensors to the printed circuit board.

42. The process of claim 38, wherein the substrate includes generally planar top and bottom surfaces, and the pyramid-shaped body is coupled to the top surface.

43. The process of claim 42, further comprising the step of disposing an integrated circuit on the bottom surface when the strain sensors are piezoelectric strain sensors.

44. The process of claim 43, further comprising the step of electrically coupling the integrated circuit to the printed circuit.

45. The process of claim 43, wherein the integrated circuit is displaced from the pyramid-shaped body.

46. The process of claim 43, wherein the integrated circuit includes a buffer amplifier.

47. The process of claim 25, further comprising the step of coupling the resistive strain sensors to the opposed faces with an adhesive.

48. The process of claim 47, wherein the adhesive is an epoxy.

49. A three-axis sensor assembly comprising:

a three-axis sensor assembly embedded in a material, said three-axis sensor assembly including two pairs of strain sensors, a first pair disposed on first opposed faces of a pyramid-shaped body so as to deform in response to strain in the material transmitted directly to said first pair in a first direction, and a second pair disposed on second opposed faces of the pyramid-shaped body so as to deform in response to strain in the material transmitted directly to said second pair in a second direction;

a printed circuit responsive to the outputs of said strain sensors to generate a corresponding signal indicative of the corresponding strain acting on the material; and

wherein the sensor assembly is electrically coupled to the printed circuit.

50. The three-axis sensor assembly of claim 49, wherein the strain sensors are resistive strain sensors.