Method for improved lithographic patterning utilizing multiple coherency optimized exposures and high transmission attenuated PSM
First Claim
1. A method for optically transferring a lithographic pattern corresponding to an integrated circuit utilizing a high transmission attenuated phase-shift mask onto a semiconductor substrate by use of an optical exposure tool, said method comprising the steps of:
- generating a diffraction pattern corresponding to said lithographic pattern, said diffraction pattern indicating a plurality of spatial frequency components corresponding to said lithographic pattern;
determining which of said spatial frequency components need to be captured by a lens in said optical exposure tool in order to accurately reproduce said lithographic pattern;
determining a set of illumination conditions required for said optical exposure tool to capture said spatial frequency components necessary for accurately reproducing said lithographic pattern; and
illuminating said high transmission attenuated phase-shift mask with said set of said illumination conditions.
3 Assignments
0 Petitions
Accused Products
Abstract
A method for optically transferring a lithographic pattern corresponding to an integrated circuit utilizing a high transmission attenuated phase-shift mask onto a semiconductor substrate by use of an optical exposure tool. The method comprising the steps of generating a diffraction pattern corresponding to the lithographic pattern, where the diffraction pattern indicates a plurality of spatial frequency components corresponding to the lithographic pattern; determining which of the spatial frequency components need to be captured by a lens in the optical exposure tool in order to accurately reproduce the lithographic pattern; determining a set of illumination conditions required for the optical exposure tool to capture the spatial frequency components necessary for accurately reproducing the lithographic pattern; and illuminating the high transmission attenuated phase-shift mask with this set of illumination conditions.
-
Citations
11 Claims
-
1. A method for optically transferring a lithographic pattern corresponding to an integrated circuit utilizing a high transmission attenuated phase-shift mask onto a semiconductor substrate by use of an optical exposure tool, said method comprising the steps of:
-
generating a diffraction pattern corresponding to said lithographic pattern, said diffraction pattern indicating a plurality of spatial frequency components corresponding to said lithographic pattern;
determining which of said spatial frequency components need to be captured by a lens in said optical exposure tool in order to accurately reproduce said lithographic pattern;
determining a set of illumination conditions required for said optical exposure tool to capture said spatial frequency components necessary for accurately reproducing said lithographic pattern; and
illuminating said high transmission attenuated phase-shift mask with said set of said illumination conditions. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
-
-
9. A device manufacturing method comprising the steps of:
-
generating a diffraction pattern corresponding to a lithographic pattern, said diffraction pattern indicating a plurality of spatial frequency components corresponding to said lithographic pattern;
determining which of said spatial frequency components need to be captured by a lens in an optical exposure tool in order to accurately reproduce said lithographic pattern on a substrate;
determining a set of illumination conditions required for said optical exposure tool to capture said spatial frequency components necessary for accurately reproducing said lithographic pattern; and
illuminating a high transmission attenuated phase-shift mask with said set of said illumination conditions.
-
-
10. A method for generating a mask, said method comprising the steps of:
-
generating a diffraction pattern corresponding to a lithographic pattern to be imaged, said diffraction pattern indicating a plurality of spatial frequency components corresponding to said lithographic pattern;
determining which of said spatial frequency components need to be captured by a lens in an optical exposure tool in order to accurately reproduce said lithographic pattern; and
forming a reticle having a pattern which allows said spatial frequency components to be captured to be imaged on a substrate. - View Dependent Claims (11)
-
Specification