Processing system and method for chemically treating a substrate
First Claim
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1. A processing system for chemically treating a substrate comprising:
- a temperature controlled chemical treatment chamber;
a temperature controlled substrate holder mounted within said chemical treatment chamber and configured to be substantially thermally isolated from said chemical treatment chamber;
a vacuum pumping system coupled to said chemical treatment chamber; and
a gas distribution system coupled to said chemical treatment chamber and configured to introduce one or more process gases to said chemical treatment chamber in order to chemically alter exposed surface layers on said substrate, wherein said gas distribution system comprises a temperature controlled portion exposed to said one or more process gases in said chemical treatment chamber, wherein said gas distribution system comprises at least one gas distribution plate, said gas distribution plate comprises one or more gas injection orifices.
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Abstract
A processing system and method for chemically treating a substrate, wherein the processing system comprises a temperature controlled chemical treatment chamber, and an independently temperature controlled substrate holder for supporting a substrate for chemical treatment. The substrate holder is thermally insulated from the chemical treatment chamber. The substrate is exposed to a gaseous chemistry, without plasma, under controlled conditions including wall temperature, surface temperature and gas pressure. The chemical treatment of the substrate chemically alters exposed surfaces on the substrate.
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Citations
36 Claims
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1. A processing system for chemically treating a substrate comprising:
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a temperature controlled chemical treatment chamber;
a temperature controlled substrate holder mounted within said chemical treatment chamber and configured to be substantially thermally isolated from said chemical treatment chamber;
a vacuum pumping system coupled to said chemical treatment chamber; and
a gas distribution system coupled to said chemical treatment chamber and configured to introduce one or more process gases to said chemical treatment chamber in order to chemically alter exposed surface layers on said substrate, wherein said gas distribution system comprises a temperature controlled portion exposed to said one or more process gases in said chemical treatment chamber, wherein said gas distribution system comprises at least one gas distribution plate, said gas distribution plate comprises one or more gas injection orifices. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A method of operating a processing system to chemically treat a substrate comprising:
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transferring said substrate into a chemical treatment system comprising a temperature controlled chemical treatment chamber, a temperature controlled substrate holder mounted within said chemical treatment chamber and configured to be substantially thermally insulated from said chemical treatment chamber, a vacuum pumping system coupled to said chemical treatment chamber, a gas distribution system configured to introduce one or more process gases into said chemical treatment chamber and having a temperature controlled portion exposed to said one or more process gases in said chemical treatment chamber, and a controller coupled to said chemical treatment system;
setting chemical processing parameters for said chemical treatment system using said controller, wherein said chemical processing parameters comprise a chemical treatment processing pressure, a chemical treatment chamber temperature, a chemical treatment substrate temperature, a chemical treatment substrate holder temperature, and a chemical treatment gas flow rate; and
processing said substrate in said chemical treatment system using said chemical processing parameters in order to chemically alter exposed surface layers on said substrate, wherein said gas distribution system comprises at least one gas distribution plate, said gas distribution plate comprises one or more gas injection orifices. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36)
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Specification