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Anchors for microelectromechanical systems having an SOI substrate, and method of fabricating same

  • US 6,952,041 B2
  • Filed: 07/25/2003
  • Issued: 10/04/2005
  • Est. Priority Date: 07/25/2003
  • Status: Expired due to Fees
First Claim
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1. An electromechanical device comprising:

  • a substrate;

    an insulation layer disposed on the substrate;

    a first semiconductor layer disposed on or above the insulation layer;

    an anchor that is disposed in an opening in the insulation layer and the first semiconductor layer and contacts the substrate, wherein the anchor includes a material that is different than the insulation layer;

    a second semiconductor layer, disposed on the anchor and on the first semiconductor layer; and

    a fixed electrode, formed, in part, from the first and second semiconductor layers, wherein the fixed electrode is affixed to the substrate via the anchor.

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  • 3 Assignments
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