Wafer fabrication data acquisition and management systems

• US 6,952,656 B1
• Filed: 04/28/2000
• Issued: 10/04/2005
• Est. Priority Date: 04/28/2000
• Status: Expired due to Term

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Doyle, Terry L., Louneva, Inna, Lyon, Richard C., Lobovski, Evgueni, Cordova, Sherry, Toh, Woon Young, Nolet, Clari, Nishimura, Yukari, Kroupnova, Natalia, Reiss, Terry, Wilmer, Michael E.
• Primary Examiner(s): Hoff, Marc S.
• Assistant Examiner(s): KIM, PAUL L
• Application Number:
  US09/561,440
• Time in Patent Office: 1,985 Days
• Field of Search: 702/122, 702/117, 702/188, 710/1, 700/121, 700/117, 700/96, 701/1
• US Class Current: 702/117
• CPC Class Codes: G05B 19/042 using digital processors G05B19/05 takes precedence

Abstract

The present invention provides a semiconductor processing device (800) including a tool (802) having one or more sensors, a primary data communication port (804) and a secondary data communication port (806). A sensor data acquisition subsystem (808) acquires sensor data from the tool via the secondary port (806). The data acquisition subsystem (808) acquires MES operation messages via the primary port (804). Sensor data are communicated to a sensor processing unit (828) of a sensor data processing subsystem (810). The sensor processing unit (828) processes and analyzes the sensor data. Additionally, the processing unit (828) can be adapted for making product or processing related decisions, for example activating an alarm if the process is not operating within control limits. In another embodiment, the present invention provides a method and apparatus for processing data from a wafer fab facility (1000) including a plurality of tools (1004–1010) each having a primary data communication port (1012–1018) and a secondary data communication port (1042–1048).

Claims

1. A method for processing data from a wafer fabricating chamber wherein the chamber includes at least one sensor, a first data communication port and a second data communication port, the method comprising:

a) executing operational instructions to the chamber via the first port wherein the first port comprises a serial port communicating data at a maximum baud rate of about 19200 and wherein the first port includes an interface protocol supporting standard SECS II messages;

b) operating the at least one sensor for sensing and then reporting sensor data; and

c) communicating the sensor data to a computer implemented data acquisition process via the second port, wherein the second port comprises a serial port communicating data at a maximum baud rate of about 38400 and wherein the second port includes an interface protocol supporting messages comprising standard SECS II messages and custom SECS II messages.

2. A semiconductor processing device including a wafer fabricating chamber, the device comprising:

a) a first data communication port, wherein the first port communicates computer executable messages to the chamber and wherein the first port comprises a first interface for communicating standard SECS II messages;

b) a second data communication port, wherein the second port communicates computer executable messages to the chamber and wherein the second port comprises a second interface for communicating messages comprising standard SECS II messages and custom SECS II messages; and

c) at least one sensor provided to the chamber for sensing and then reporting data selected from the group consisting of process data, product data and equipment parameter data, wherein the at least one sensor communicates with the second port.

3. A method for processing data from a wafer fabricating chamber wherein the chamber includes at least one sensor, a first data communication port and a second data communication port, the method comprising:

a) executing operational instructions to the chamber via the first port, wherein the first port includes an interface protocol supporting standard SECS II messages;

b) operating the at least one sensor for sensing and then reporting sensor data; and

c) communicating the sensor data to a computer implemented data acquisition process via the second port, wherein the second port includes an interface protocol supporting custom SECS II messages.

4. A semiconductor processing device including a wafer fabricating chamber, the device comprising:

a) a first data communication port, wherein the first port communicates computer executable messages to the chamber, and wherein the first port includes an interface protocol supporting standard SECS II messages;

b) a second data communication port, wherein the second port communicates computer executable messages to the chamber and wherein the second port includes an interface protocol supporting custom SECS II messages; and

c) at least one sensor provided to the chamber for sensing and then reporting data selected from the group consisting of process data, product data and equipment parameter data, wherein the at least one sensor communicates with the second port.

5. A method for processing data from a wafer fabricating chamber wherein the chamber includes a first data communication port and a second data communication port, the method comprising:

a) executing operational instructions to the chamber via the first port, wherein the first port comprises a serial data communication port utilizing an interface protocol and wherein the first port comprises the serial port including an interface protocol supporting standard SECS II messages; and

b) communicating data from the chamber to a computer implemented data acquisition process via the second port, wherein the second port comprises a serial data communication port utilizing an interface protocol, and wherein the second port comprises the serial port including an interface protocol supporting custom SECS II messages.

6. A semiconductor processing device including a wafer fabricating chamber, the device comprising:

a) a first data communication port for communicating computer executable messages to the chamber, wherein the first port comprises a serial port including an interface protocol supporting standard SECS II messages; and

b) a second data communication port for communicating computer executable messages to the chamber, wherein the second port comprises a serial port including an interface protocol supporting custom SECS II messages.

7. The device of claim 6 additionally comprising:

a) a data acquisition subsystem;

b) a data processing subsystem;

c) an information processing and analyzing environment; and

d) a decision making environment for determining whether the process is operating within predetermined control limits, wherein the decision making environment is adapted for activating an alarm.

8. The device of claim 7 additionally comprising the chamber having a sensor from which sensor data are communicated to the second port.

9. A semiconductor wafer fabricating chamber including at least one sensor, a first serial data communication port and a second serial data communication port, the chamber comprising:

a) the at least one sensor positioned inside the chamber, wherein the sensor is adapted for providing sensor data;

b) the first serial data communication port adapted for communicating computer executable messages including MES messages wherein the first port includes a first interface protocol supporting standard SECS II messages at a maximum baud rate of about 19200; and

c) the second serial data communication port adapted for communicating data comprising enhanced data acquisition system data including sensor data, wherein the second port comprises a second interface protocol supporting messages including (i) standard SECS II messages and (ii) custom SECS II messages, wherein the second port operates at a maximum baud rate of about 38400.