Manufacture method of semiconductor device with gate insulating films of different thickness
First Claim
1. A method of manufacturing a semiconductor device, comprising steps of:
- (a) forming a first gate insulating film having a first thickness in a plurality of regions on a surface of a semiconductor substrate;
(b) removing the first gate insulating film in a first region among the plurality of regions and allowing a native oxide film to be formed;
(c) heating the semiconductor substrate in a reducing atmosphere and selectively reducing and removing the native oxide film formed in said step (b) to a thickness of 0.1 nm or less; and
(d) after said step (c), forming a second gate insulating film having a second thickness thinner than the first thickness on the surface of the semiconductor substrate in the first region.
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Abstract
A method of manufacturing a semiconductor device, having the steps of: (a) forming a first gate insulating film having a first thickness in a plurality of regions on a surface of a semiconductor substrate; (b) removing the first gate insulating film in a first region among the plurality of regions and allowing a native oxide film to be formed; (c) heating the semiconductor substrate in a reducing atmosphere and selectively reducing and removing the native oxide film formed in the step (b); and (d) after the step (c), forming a second gate insulating film having a second thickness thinner than the first thickness on the surface of the semiconductor substrate in the first region.
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Citations
11 Claims
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1. A method of manufacturing a semiconductor device, comprising steps of:
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(a) forming a first gate insulating film having a first thickness in a plurality of regions on a surface of a semiconductor substrate;
(b) removing the first gate insulating film in a first region among the plurality of regions and allowing a native oxide film to be formed;
(c) heating the semiconductor substrate in a reducing atmosphere and selectively reducing and removing the native oxide film formed in said step (b) to a thickness of 0.1 nm or less; and
(d) after said step (c), forming a second gate insulating film having a second thickness thinner than the first thickness on the surface of the semiconductor substrate in the first region. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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Specification